On the root cause of Kirkendall voiding in Cu3Sn von Yin, Liang, Borgesen, Peter

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Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling von Hamasha, Sa'd, Borgesen, Peter

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Hydrogen evolution and thermal treatments for removal of plating induced impurities from Ni to extend life of solder joints von Lei, Zhen, Borgesen, Peter, Dimitrov, Nikolay

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Preventing Void Growth Between Ni3Sn4 and Solder von Njuki, M., Thekkut, S., Das, R., Borgesen, P., Dimitrov, N.

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Reduced nitrogen leaching by intercropping maize with red fescue on sandy soils in North Europe: a combined field and modeling study von Manevski, Kiril, Børgesen, Christen D, Andersen, Mathias N, Kristensen, Ib S

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Parameterization of two‐dimensional approaches in HYDRUS‐2D: Part 2. Solute transport at the field and column scale von Varvaris, Ioannis, Pittaki‐Chrysodonta, Zampela, Duus Børgesen, Christen, Iversen, Bo Vangsø

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Understanding and preventing Cu–Sn micro joint defects through design and process control von Njuki, M., Thekkut, S., Das, R., Shahane, N., Thompson, P., Mirpuri, K., Borgesen, P., Dimitrov, N.

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All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints von Njuki, Michael, Pasha, Abdullah Faisal, Das, Ronit, Borgesen, Peter, Dimitrov, Nikolay

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Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel von Lei, Zhen, Borgesen, Peter, Dimitrov, Nikolay

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Classifying the Dimensional Variation in Additive Manufactured Parts From Laser-Scanned Three-Dimensional Point Cloud Data Using Machine Learning Approaches von Samie Tootooni, M, Dsouza, Ashley, Donovan, Ryan, Rao, Prahalad K, Kong, Zhenyu (James), Borgesen, Peter

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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue von Yin, Liang, Wentlent, Luke, Yang, Linlin, Arfaei, Babak, Oasaimeh, Awni, Borgesen, Peter

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Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life von Hamasha, Sa'd, Akkara, Francy, Su, Sinan, Ali, Haneen, Borgesen, Peter

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Review of scenario analyses to reduce agricultural nitrogen and phosphorus loading to the aquatic environment von Hashemi, Fatemeh, Olesen, Jørgen E., Dalgaard, Tommy, Børgesen, Christen D.

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Challenging traditional leadership behaviors in a distributed and ambiguous knowledge-intensive work environment von Borgesen, Kenneth

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Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue von Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., Borgesen, P.

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Ventriculosinus shunt: a pilot study to investigate new technology to treat hydrocephalus and mimic physiological principles of cerebrospinal fluid drainage von Munthe, Sune, Pedersen, Christian Bonde, Poulsen, Frantz Rom, Andersen, Mikkel Schou, Børgesen, Svend Erik

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Computational Fluid Dynamics Modeling and Online Monitoring of Aerosol Jet Printing Process von Salary, Roozbeh (Ross), Lombardi, Jack P, Samie Tootooni, M, Donovan, Ryan, Rao, Prahalad K, Borgesen, Peter, Poliks, Mark D

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Solder joint reliability under realistic service conditions von Borgesen, P., Hamasha, S., Obaidat, M., Raghavan, V., Dai, X., Meilunas, M., Anselm, M.

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Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications von Alshatnawi, Firas, Alhendi, Mohammed, Abbara, El Mehdi, Sivasubramony, Rajesh, Garakani, Behnam, Enakerakpo, Emuobosan, Shaddock, David, Stoffel, Nancy, Hoel, Cathleen, Poliks, Mark D., Borgesen, Peter

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Impacts of land use, climate change and hydrological model structure on nitrate fluxes: Magnitudes and uncertainties von Seidenfaden, Ida Karlsson, Sonnenborg, Torben Obel, Børgesen, Christen Duus, Trolle, Dennis, Olesen, Jørgen Eivind, Refsgaard, Jens Christian

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