False Piezoresistive Effect Detection von Kalenik, Jerzy, Stęplewski, Wojciech, Borecki, Janusz, Chołaj, Aneta, Kozłowski, Mirosław, Serzysko, Tomasz

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Mechanical reliability of solder joints in PCBs assembled in surface mount technology von Borecki, Janusz, Serzysko, Tomasz

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The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials von Sitek, Janusz, Koscielski, Marek, Borecki, Janusz, Serzysko, Tomasz

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Assessment of stability and reliability of embedded components in printed circuit boards von Steplewski, Wojciech, Dziedzic, Andrzej, Borecki, Janusz, Serzysko, Tomasz

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Piezoresistive effect in embedded thick-film resistors von Borecki, Janusz, Araźna, Aneta, Janeczek, Kamil, Kalenik, Jerzy, Kalenik, Michał, Stęplewski, Wojciech, Tarakowski, Rafał

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Thermal stability analysis of passive components embedded into printed circuit boards von Stęplewski, Wojciech, Dziedzic, Andrzej, Janeczek, Kamil, Araźna, Aneta, Lipiec, Krzysztof, Borecki, Janusz, Serzysko, Tomasz

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Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors von Steplewski, Wojciech, Dziedzic, Andrzej, Borecki, Janusz, Koziol, Grazyna, Serzysko, Tomasz

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Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors von Steplewski, Wojciech, Dziedzic, Andrzej, Borecki, Janusz, Koziol, Grazyna, Serzysko, Tomasz

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Application of direct bonded copper substrates for prototyping of power electronic modules von Grzesiak, Wojciech, Maćków, Piotr, Maj, Tomasz, Synkiewicz, Beata, Witek, Krzysztof, Kisiel, Ryszard, Myśliwiec, Marcin, Borecki, Janusz, Serzysko, Tomasz, Żupnik, Marek

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Problems of PCB microvias filling by conductive paste von Kisiel, Ryszard, Felba, Jan, Borecki, Janusz, Moscicki, Andrzej

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Reactance components embedded in printed circuit boards von Stęplewski, Wojciech, Dziedzic, Andrzej, Kłossowicz, Adam, Winiarski, Paweł, Borecki, Janusz, Kozioł, Grażyna, Serzysko, Tomasz

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Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBs von Koscielski, Marek, Glinski, Krzysztof, Ostaszewski, Dariusz, Oklej, Jan, Klej, Tomasz, Cholaj, Aneta, Steplewski, Wojciech, Galinski, Stefan, Borecki, Janusz

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Conductive adhesives for through holes and blind vias metallization von Kisiel, Ryszard, Borecki, Janusz, Kozioł, Grażyna, Felba, Jan

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Problems of PCB microvias filling by conductive paste : Polytronic 2005 von KISIEL, Ryszard, FELBA, Jan, BORECKI, Janusz, MOSCICKI, Andrzej

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Nano-silver inkjet printed interconnections through the microvias for flexible electronics von Falat, T., Felba, J., Moscicki, A., Borecki, J.

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Analysis blind microvias forming process in multilayer printed circuit boards von Warycha Joanna, Borecki Janusz

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Cleaner for use in electronics von ARAŹNA, ANETA, LIPIEC, KRZYSZTOF, BORECKI, JANUSZ, JANECZEK, KAMIL, LISZEWSKA, DOROTA, SITEK, ANNA

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Interconnection process by ink jet printing method von Moscicki, A., Falat, T., Smolarek, A., Kinart, A., Felba, J., Borecki, J.

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Cleaner for use in electronics von ARAŹNA, ANETA, LIPIEC, KRZYSZTOF, BORECKI, JANUSZ, JANECZEK, KAMIL, LISZEWSKA, DOROTA, SITEK, ANNA

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Numerical Modeling of Electrical Resistance of Interconnections in High-Tech Multilayer PCBs Manufactured by Magnetron Sputtering Deposition of Copper von Borecki, J., Wymyslowski, A.

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