Superconformal electrodeposition of copper in 500-90 nm features von MOFFAT, T. P, BONEVICH, J. E, HUBER, W. H, STANISHEVSKY, A, KELLY, D. R, STAFFORD, G. R, JOSELL, D

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Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing von Moffat, T. P., Walker, M., Chen, P. J., Bonevich, J. E., Egelhoff, W. F., Richter, L., Witt, C., Aaltonen, T., Ritala, M., Leskelä, M., Josell, D.

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A simple equation for predicting superconformal electrodeposition in submicrometer trenches von JOSELL, D, WHEELER, D, HUBER, W. H, BONEVICH, J. E, MOFFAT, T. P

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Superconductivity in Nb-Sn Thin Films of Stoichiometric and Off-Stoichiometric Compositions von Mentink, M. G. T., Bonevich, J. E., Dhalle, M. M. J., Dietderich, D. R., Godeke, A., Hellman, F., ten Kate, H. H. J.

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Crystalline domain size and faulting in the new NIST SRM 1979 zinc oxide von Cline, J. P., Leoni, M., Black, D., Henins, A., Bonevich, J. E., Whitfield, P. S., Scardi, P.

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Electrical properties of superfilled sub-micrometer silver metallizations von Josell, D., Burkhard, C., Li, Y., Cheng, Y.-W., Keller, R. R., Witt, C. A., Kelley, D. R., Bonevich, J. E., Baker, B. C., Moffat, T. P.

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Heat transfer through nanoscale multilayered thermal barrier coatings at elevated temperatures von Josell, D., Bonevich, J.E., Nguyen, T.M., Johnson, R.N.

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Fabrication and measurement of tall stacked arrays of SNS Josephson junctions von Hadacek, N., Dresselhaus, P.D., Chong, Y., Benz, S.P., Bonevich, J.E.

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Superconformal electrodeposition of silver in submicrometer features von MOFFAT, T. P, BAKER, B, JOSELL, D, WHEELER, D, BONEVICH, J. E, EDELSTEIN, M, KELLY, D. R, GAN, L, STAFFORD, G. R, CHEN, P. J, EGELHOFF, W. F

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Superconformal electrodeposition of copper in 500-90 nm features von Moffat, T P, Bonevich, J E, Huber, W H, Stanishevsky, A, Kelly, D R, Stafford, G R, Josell, D

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Electrochemistry of titanium and the electrodeposition of Al-Ti alloys in the Lewis acidic aluminum chloride-1-ethyl-3-methylimidazolium chloride melt von TSUDA, Tetsuya, HUSSEY, Charles L, STAFFORD, Gery R, BONEVICH, John E

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Electron holography observation of vortex lattices in a superconductor von BONEVICH, J. E, HARADA, K, MATSUDA, T, KASAI, H, YOSHIDA, T, POZZI, G, TONOMURA, A

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Strong anisotropy in thin magnetic films deposited on obliquely sputtered Ta underlayers von McMichael, R. D., Lee, C. G., Bonevich, J. E., Chen, P. J., Miller, W., Egelhoff, W. F.

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Structure and Magnetic Anisotropy of Electrodeposited Co on n-GaAs(001) von Ford, A., Bonevich, J. E., McMichael, R. D., Vaudin, M., Moffat, T. P.

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Strong anisotropy in thin magnetic films deposited on obliquely sputtered Ta underlayers von McMichael, R. D., Lee, C. G., Bonevich, J. E., Chen, P. J., Miller, W., Egelhoff, W. F.

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Measuring the interface stress: Silver/nickel interfaces von Josell, D., Bonevich, J. E., Shao, I., Cammarata, R. C.

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Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers von Gonzalez, E. J., Bonevich, J. E., Stafford, G. R., White, G., Josell, D.

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Inducing analytical orthogonality in tungsten oxide-based microsensors using materials structure and dynamic temperature control von Benkstein, K.D., Raman, B., Lahr, D.L., Bonevich, J.E., Semancik, S.

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Vortex configuration and dynamics in Bi2Sr1.8CaCu2Ox thin films by Lorentz microscopy von HARADA, K, MATSUDA, T, KASAI, H, BONEVICH, J. E, YOSHIDA, T, KAWABE, U, TONOMURA, A

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Effects of interlayer electrode thickness in Nb/(MoSi2/Nb)N stacked Josephson junctions von Chong, Yonuk, Dresselhaus, P. D., Benz, S. P., Bonevich, J. E.

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