High yield four-point bend thin film adhesion testing techniques von Birringer, Ryan P., Chidester, Paula J., Dauskardt, Reinhold H.

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Environmentally assisted debonding of copper/barrier interfaces von Birringer, Ryan P., Shaviv, Roey, Besser, Paul R., Dauskardt, Reinhold H.

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Failure Analysis of Internal Fixation Medical Devices: Overview and Case Studies von Birringer, Ryan P, Ganot, Gabriel S, James, Brad A

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Low-temperature Al–Ge bonding for 3D integration von Crnogorac, Filip, Pease, Fabian R. W., Birringer, Ryan P., Dauskardt, Reinhold H.

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Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper/dielectric diffusion barrier films von Birringer, Ryan P., Shaviv, Roey, Geiss, Roy H., Read, David T., Dauskardt, Reinhold H.

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Bilayer metal gate electrodes with tunable work function: Adhesion and interface characterization von Birringer, Ryan P., Lu, Ching-Huang, Deal, Michael, Nishi, Yoshio, Dauskardt, Reinhold H.

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VENT ASSEMBLIES von Joseph, Stephen C.P, Hegdahl, Anna M, Tarnowski, Steven J, Birringer, Ryan P, Erickson, Ryan D

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VENT ASSEMBLIES von TARNOWSKI, Steven J, HEGDAHL, Anna M, BIRRINGER, Ryan P, JOSEPH, Stephen C. P, ERICKSON, Ryan D

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