In Situ Characterization of Twin Nucleation in Pure Ti Using 3D-XRD von Bieler, Thomas R., Wang, Leyun, Beaudoin, Armand J., Kenesei, Peter, Lienert, Ulrich

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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints von Bieler, Thomas R., Zhou, Bite, Blair, Lauren, Zamiri, Amir, Darbandi, Payam, Pourboghrat, Farhang, Lee, Tae-Kyu, Liu, Kuo-Chuan

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The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests von Darbandi, Payam, Bieler, Thomas R., Pourboghrat, Farhang, Lee, Tae-kyu

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The effect of microstructure on the relationship between grain boundary sliding and slip transmission in high purity aluminum von Linne, Marissa A., Bieler, Thomas R., Daly, Samantha

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Computational design of metal oxides to enhance the wetting and adhesion of silver-based brazes on yttria-stabilized-zirconia von Phongpreecha, Thanaphong, Nicholas, Jason D., Bieler, Thomas R., Qi, Yue

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In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction a... von Zhou, Quan, Lee, Tae-Kyu, Bieler, Thomas R.

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Transient porous nickel interlayers for improved silver-based Solid Oxide Fuel Cell brazes von Zhou, Quan, Bieler, Thomas R., Nicholas, Jason D.

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Effect of cutting speed on shear band formation and chip morphology of Ti–6Al–4V alloy using nanoindentation and EBSD mapping von Lu, Jiawei, Khawarizmi, Ryan, Monclús, Miguel, Molina-Aldareguia, Jon, Kwon, Patrick, Bieler, Thomas R.

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Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages von Zhou, Bite, Zhou, Quan, Bieler, Thomas R., Lee, Tae-kyu

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Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints von Zuo, Yong, Bieler, Thomas R., Zhou, Quan, Ma, Limin, Guo, Fu

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Analysis of slip transfer and deformation behavior across the α/β interface in Ti–5Al–2.5Sn (wt.%) with an equiaxed microstructure von Seal, James R., Crimp, Martin A., Bieler, Thomas R., Boehlert, Carl J.

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Investigation of the effect of structural defects from hydride precipitation on superconducting properties of high purity SRF cavity Nb using magneto-optical and electron imaging m... von Wang, Mingmin, Polyanskii, Anatolii, Balachandran, Shreyas, Chetri, Santosh, Crimp, Martin A, Lee, Peter J, Bieler, Thomas R

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The Effect of Ti-6Al-4V Microstructure, Cutting Speed, and Adiabatic Heating on Segmented Chip Formation and Tool Life von Khawarizmi, Ryan M., Lu, Jiawei, Nguyen, Dinh S., Bieler, Thomas R., Kwon, Patrick

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Phase Dependent Tool Wear in Turning Ti-6Al-4V Using Polycrystalline Diamond and Carbide Inserts von Schrock, David J, Kang, Di, Bieler, Thomas R, Kwon, Patrick

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Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints von Darbandi, Payam, Lee, Tae-kyu, Bieler, Thomas R., Pourboghrat, Farhang

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The Origin of Flank Wear in Turning Ti-6Al-4V von Nguyen, Trung, Kwon, Patrick, Kang, Di, Bieler, Thomas R

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Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD von Zhou, Bite, Bieler, Thomas R., Lee, Tae-Kyu, Liu, Wenjun

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy von Lee, Tae-Kyu, Zhou, Bite, Blair, Lauren, Liu, Kuo-Chuan, Bieler, Thomas R.

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Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects von Lee, Tae-Kyu, Kim, Choong-Un, Bieler, Thomas R.

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Near-field microwave magnetic nanoscopy of superconducting radio frequency cavity materials von Tai, Tamin, Ghamsari, Behnood G., Bieler, Thomas R., Tan, Teng, Xi, X. X., Anlage, Steven M.

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