INTEGRATED CIRCUIT AND PROCESS FOR DEPOSITING HIGH-ASPECT RATIO FUNCTIONAL GAP FILL THEREOF von BIBEKKU SAKUSENA, ABDELGADIR MAHJOUB ALI

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INTEGRATED CIRCUIT WITH DIFFUSION PREVENTING BARRIER LAYER OF INTER-METAL LAYER DIELECTRIC, AND METHOD OF MANUFACTURING THE SAME von MERCHANT SAILESH MANSINH, BIBEKKU SAKUSENA, ABDELGADIR MAHJOUB ALI, NEISU RAYADI, PAI H I

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Deposition process for gap filling high-aspect ratio features in integrated circuits von BIBEKKU SAKUSENA, ABDELGADIR MAHJOUB ALI

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MANUFACTURING METHOD OF RESISTOR von BIBEKKU SAKUSENA, SEUNGUMOO CHOI, PAI H II, AMAR MA HAMAD, FLEX REBADA

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METHOD FOR FORMING A CONTACT-POINT OPENING IN DIELECTRICS LAYER OF SEMICONDUCTOR DEVICE von BIBEKKU SAKUSENA, SEUNGUMOO CHOI, PAI H II, AMAR MA HAMAD, FLEX REBADA

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INTEGRATED CIRCUIT COMPRISING DIFFUSION-PREVENTIVE BARRIER LAYER WITH INTER-METAL LAYER 0, AND MANUFACTURING METHOD THEREOF von MERCHANT SAILESH MANSINH, BIBEKKU SAKUSENA, ABDELGADIR MAHJOUB ALI, NEISU RAYADI, PAI H I

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DIFFUSION PREVENTING BARRIER LAYER IN INTEGRATED CIRCUIT INTER-METAL LAYER DIELECTRICS von BIBEKKU SAKUSENA, MERCHANT SAILESH MANSINH, ABDELGADIR MAHJOUB ALI, NEISU RAYADI, PAI H. E

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METHOD FOR FORMING CONTACT OPENING-POINT IN DIELECTRICS LAYER OF SEMICONDUCTOR DEVICE von BIBEKKU SAKUSENA, SEUNGUMOO CHOI, PAI H II, AMAR MA HAMAD, FLEX REBADA

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4 High resistivity silicon carbide film for 4T SRAM von BIBEKKU SAKUSENA, SEUNGUMOO CHOI, PAI H II, AMAR MA HAMAD, FLEX REBADA

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