Thermal stability, mechanical and electrical properties of nanocrystalline Cu3Ge von Darling, Kris A., Guduru, R.K., Reynolds, C. Lewis, Bhosle, Vikram M., Chan, Ryan N., Scattergood, Ronald O., Koch, Carl C., Narayan, J., Aboelfotoh, M.O.

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PLASMA BASED FILM MODIFICATION FOR SEMICONDUCTOR DEVICES von Bhosle, Vikram M, Miller, Timothy J

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Cover ring to mitigate carbon contamination in plasma doping chamber von Leavitt, Christopher J, Bhosle, Vikram M, Miller, Timothy J, Hermanson, Eric D, Tye, Jordan B

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Thermal stability, mechanical and electrical properties of nanocrystalline Cu 3Ge von Darling, Kris A., Guduru, R.K., Reynolds, C. Lewis, Bhosle, Vikram M., Chan, Ryan N., Scattergood, Ronald O., Koch, Carl C., Narayan, J., Aboelfotoh, M.O.

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SYSTEM AND METHOD FOR REDUCING PARTICLE FORMATION IN A PROCESS CHAMBER OF AN ION IMPLANTER von BHOSLE, Vikram M, STRATOTI, Gregory Edward, KOO, Bon-Woong, SINCLAIR, Frank, HSIEH, Tseh-Jen

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System and Method for Reducing Particle Formation in a Process Chamber of an Ion Implanter von Sinclair, Frank, Bhosle, Vikram M, Koo, Bon-Woong, Stratoti, Gregory Edward, Hsieh, Tseh-Jen

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FLUORINE BASED CLEANING FOR PLASMA DOPING APPLICATIONS von Deno, Vincent, Mittal, Deven Matthew Raj, Cai, Meng, Bhosle, Vikram M

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FLUORINE BASED CLEANING FOR PLASMA DOPING APPLICATIONS von CAI, Meng, BHOSLE, Vikram M, DENO, Vincent, MITTAL, Deven Matthew Raj

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CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS von Lee, Jun Seok, Mittal, Deven Raj, Bhosle, Vikram M, Miller, Timothy J

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CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS von BHOSLE, Vikram M, LEE, Jun Seok, MILLER, Timothy J, MITTAL, Deven Raj

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COVER RING TO MITIGATE CARBON CONTAMINATION IN PLASMA DOPING CHAMBER von BHOSLE, Vikram M, TYE, Jordan B, LEAVITT, Christopher J, MILLER, Timothy J, HERMANSON, Eric D

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COVER RING TO MITIGATE CARBON CONTAMINATION IN PLASMA DOPING CHAMBER von Leavitt, Christopher J, Bhosle, Vikram M, Miller, Timothy J, Hermanson, Eric D, Tye, Jordan B

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Plasma processing apparatus and techniques von Leavitt, Christopher J, Colom, Guillermo, Bhosle, Vikram M, Miller, Timothy J

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Sacrificial capping layer for passivation using plasma-based implant process von Bateman, Nicholas P. T, Lee, Jun Seok, Mittal, Deven Raj, Bhosle, Vikram M, Miller, Timothy J

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Sacrificial Capping Layer For Passivation Using Plasma-Based Implant Process von Lee, Jun Seok, Mittal, Deven Raj, Bhosle, Vikram M, Bateman, Nicholas P.T, Miller, Timothy J

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SACRIFICIAL CAPPING LAYER FOR PASSIVATION USING PLASMA-BASED IMPLANT PROCESS von BHOSLE, Vikram M, BATEMAN, Nicholas P.T, LEE, Jun Seok, MILLER, Timothy J, MITTAL, Deven Raj

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PLASMA PROCESSING APPARATUS AND TECHNIQUES von Leavitt, Christopher J, Colom, Guillermo, Bhosle, Vikram M, Miller, Timothy J

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Plasma processing apparatus and techniques von Leavitt, Christopher J, Colom, Guillermo, Bhosle, Vikram M, Miller, Timothy J

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Boron implanting using a co-gas von Frontiero, John A, Bhosle, Vikram M, Koo, Bon-Woong

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PLASMA PROCESSING APPARATUS AND TECHNIQUES von BHOSLE, Vikram M, COLOM, Guillermo, LEAVITT, Christopher J, MILLER, Timothy J

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