Device and Architecture Outlook for Beyond CMOS Switches von Bernstein, Kerry, Cavin, Ralph K., Porod, Wolfgang, Seabaugh, Alan, Welser, Jeff

Volltext

Design space exploration for 3D architectures von Xie, Yuan, Loh, Gabriel H., Black, Bryan, Bernstein, Kerry

Volltext

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks von Jacob, Philip, Zia, Aamir, Erdogan, Okan, Belemjian, Paul M., Kim, Jin-Woo, Chu, Michael, Kraft, Russell P., McDonald, John F., Bernstein, Kerry

Volltext

Turning silicon on its edge [double gate CMOS/FinFET technology] von Nowak, E.J., Aller, I., Ludwig, T., Kim, K., Joshi, R.V., Ching-Te Chuang, Bernstein, K., Puri, R.

Volltext

Circuit Responses to Radiation-Induced Upsets von Bernstein, Kerry

Volltext

Device and Architecture Outlook for Beyond CMOS Switches: NANOELECTRONICS RESEARCH FOR BEYOND CMOS INFORMATION PROCESSING von BERNSTEIN, Kerry, CAVIN, Ralph K, POROD, Wolfgang, SEABAUGH, Alan, WELSER, Jeff

Volltext

High Performance CMOS Variability in the 65nm Regime and Beyond von Nassif, S., Bernstein, K., Frank, D.J., Gattiker, A., Haensch, W., Ji, B.L., Nowak, E., Pearson, D., Rohrer, N.J.

Volltext

Introduction to the digital section von Bernstein, K.

Volltext

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

Volltext bestellen

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks : Simulations indicate that 3-D stacking of memory chips can overcome memory limita... von JACOB, Philip, ZIA, Aamir, ERDOGAN, Okan, BELEMJIAN, Paul M, KIM, Jin-Woo, CHU, Michael, KRAFT, Russell P, MCDONALD, John F, BERNSTEIN, Kerry

Volltext

The 2011 DAC/ISSCC Student Design Contest Gears Up [Conference Reports] von Bernstein, Kerry

Volltext

Power supply for localized portions of an integrated circuit von BERNSTEIN KERRY

Volltext bestellen

POWER SUPPLY FOR LOCALIZED PORTIONS OF AN INTEGRATED CIRCUIT von BERNSTEIN KERRY

Volltext bestellen

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE ASSEMBLY AND METHOD OF FABRICATING THE ASSEMBLY von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

Volltext bestellen

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

Volltext bestellen

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

Volltext bestellen

Thermal switch for integrated circuits, design structure, and method of sensing temperature von Bernstein, Kerry

Volltext bestellen

Thermal switch for integrated circuits, design structure, and method of sensing temperature von BERNSTEIN KERRY

Volltext bestellen

Method and apparatus for dynamic measurement of across-chip temperatures von BERNSTEIN KERRY

Volltext bestellen

Method and apparatus for dynamic measurement of across-chip temperatures von Bernstein, Kerry

Volltext bestellen