Device and Architecture Outlook for Beyond CMOS Switches von Bernstein, Kerry, Cavin, Ralph K., Porod, Wolfgang, Seabaugh, Alan, Welser, Jeff

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Design space exploration for 3D architectures von Xie, Yuan, Loh, Gabriel H., Black, Bryan, Bernstein, Kerry

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Circuit Responses to Radiation-Induced Upsets von Bernstein, Kerry

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Does the Number of Response Options Matter? Psychometric Perspectives Using Personality Questionnaire Data von Simms, Leonard J, Zelazny, Kerry, Williams, Trevor F, Bernstein, Lee

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Introduction to the digital section von Bernstein, K.

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Moving Fiercely Linear Preservice Teachers into the Joys of Integrating Art in the Classroom: An Artist Residency in a University Early Childhood and Special Education Program von Engelmann, Julie Bernstein, Kappel, Alexandria, Kerry-Moran, Kelli Jo

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Device and Architecture Outlook for Beyond CMOS Switches: NANOELECTRONICS RESEARCH FOR BEYOND CMOS INFORMATION PROCESSING von BERNSTEIN, Kerry, CAVIN, Ralph K, POROD, Wolfgang, SEABAUGH, Alan, WELSER, Jeff

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Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks : Simulations indicate that 3-D stacking of memory chips can overcome memory limita... von JACOB, Philip, ZIA, Aamir, ERDOGAN, Okan, BELEMJIAN, Paul M, KIM, Jin-Woo, CHU, Michael, KRAFT, Russell P, MCDONALD, John F, BERNSTEIN, Kerry

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Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks von Jacob, Philip, Zia, Aamir, Erdogan, Okan, Belemjian, Paul M., Kim, Jin-Woo, Chu, Michael, Kraft, Russell P., McDonald, John F., Bernstein, Kerry

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High Performance CMOS Variability in the 65nm Regime and Beyond von Nassif, S., Bernstein, K., Frank, D.J., Gattiker, A., Haensch, W., Ji, B.L., Nowak, E., Pearson, D., Rohrer, N.J.

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Turning silicon on its edge [double gate CMOS/FinFET technology] von Nowak, E.J., Aller, I., Ludwig, T., Kim, K., Joshi, R.V., Ching-Te Chuang, Bernstein, K., Puri, R.

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Anwendung der Schematherapie in der Forensik von Klecha, Dorothee, Bersier, Katharina, Beckley, Kerry, Bernstein, David

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Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

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The 2011 DAC/ISSCC Student Design Contest Gears Up [Conference Reports] von Bernstein, Kerry

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Power supply for localized portions of an integrated circuit von BERNSTEIN KERRY

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POWER SUPPLY FOR LOCALIZED PORTIONS OF AN INTEGRATED CIRCUIT von BERNSTEIN KERRY

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ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE ASSEMBLY AND METHOD OF FABRICATING THE ASSEMBLY von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

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Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

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Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly von Michel, Bruno, Bernstein, Kerry, Brunschwiler, Thomas

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"Out-of-the-park home runs" - legendary digital circuits that tracked technology scaling von Bernstein, Kerry

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