Carry Chains for Ultra High-Speed SiGe HBT Adders von Gutin, A., Jacob, P., Chu, M., Belemjian, P. M., LeRoy, M. R., Kraft, R. P., McDonald, J. F.

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Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks von Jacob, Philip, Zia, Aamir, Erdogan, Okan, Belemjian, Paul M., Kim, Jin-Woo, Chu, Michael, Kraft, Russell P., McDonald, John F., Bernstein, Kerry

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SiGe HBT Microprocessor Core Test Vehicle von Belemjian, P.M., Erdogan, O., Kraft, R.P., McDonald, J.F.

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Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks : Simulations indicate that 3-D stacking of memory chips can overcome memory limita... von JACOB, Philip, ZIA, Aamir, ERDOGAN, Okan, BELEMJIAN, Paul M, KIM, Jin-Woo, CHU, Michael, KRAFT, Russell P, MCDONALD, John F, BERNSTEIN, Kerry

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SiGe HBT microprocessor core test vehicle: Special issue on silicon germanium - advanced technology, modeling, and design von BELEMJIAN, Paul M, ERDOGAN, Okan, KRAFT, Russell P, MCDONALD, John F

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Predicting the performance of a 3D processor-memory chip stack von Jacob, P., Erdogan, O., Zia, A., Belemjian, P.M., Kraft, R.P., McDonald, J.F.

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Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking von Jacobs, P., Zia, A., Erdogan, O., Belemjian, P., Peng Jin, Jin Woo Kim, Chu, M., Kraft, R., McDonald, J.F.

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Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers von McDonald, J.F., Erdogan, O., Jacobs, P., Belemjian, P., Gutin, A., Zia, A., Chu, M., Jin Woo Kim, Clarke, R., DeSimone, N., Liu, S., Kraft, R.P.

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