In‐gap States and Carrier Recombination in Quasi‐2D Perovskite Films von Cohen, Bat-El, Alafi, Ron, Beinglass, Jonathan, Shpatz Dayan, Adva, Goldberg, Oren, Gold, Shachar, Balberg, Isaac, Kronik, Leeor, Etgar, Lioz, Millo, Oded, Azulay, Doron

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The therapeutic potential of targeting anti-Ribosomal-P antibody in treating SLE patients with depression von Blank, Miri, Beinglass, Imbal, Shoenfeld, Yehuda

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CVD Al/PVD Al integration for advanced via and interconnect technology von Beinglass, Israel, Naik, Mehul

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Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing von Beinglass, Israel

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Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing von BEINGLASS ISRAEL

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METHODS OF FORMING A DENUDED ZONE IN A SEMICONDUCTOR WAFER USING RAPID LASER ANNEALING von BEINGLASS, ISRAEL

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Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing von BEINGLASS ISRAEL

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Integrated system for deposition of polysilicon and WSix films von BEINGLASS, I, SINHA, A. K

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Articulated object recognition, or: how to generalize the generalized Hough transform von Beinglass, A., Wolfson, H.J.

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3D semiconductor memory device and structure von Beinglass, Israel, Or-Bach, Zvi, Sekar, Deepak C, Wurman, Zeev, Cronquist, Brian

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3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE von Beinglass, Israel, Or-Bach, Zvi, Sekar, Deepak C, Wurman, Zeev, Cronquist, Brian

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Reducing the temperature of conventional silicon epitaxy for selective poly-epi growth von RAHAT, I, SHAPPIR, J, FRASER, D, WEI, J, BORLAND, J, BEINGLASS, I

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Semiconductor memory device and structure von Beinglass, Israel, Or-Bach, Zvi, Sekar, Deepak C, Wurman, Zeev, Cronquist, Brian

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Impact of the polysilicon doping level on the properties of the silicon/oxide interface in polysilicon/oxide/silicon capacitor structures von Leveugle, C., Hurley, P.K., Mathewson, A., Moran, S., Sheehan, E., Kalnitsky, A., Lepert, A., Beinglass, I., Venkatesan, M.

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Integrated system for deposition of polysilicon and WSi x films von Beinglass, Israel, Sinha, Ashok K.

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Integration of a stack of two fluorine doped silicon oxide thin films with interconnect metallization for a sub-0.35 μm inter-metal dielectric application von Baud, L., Passemard, G., Gobil, Y., M'Saad, H., Corte, A., Pires, F., Fugier, P., Noel, P., Rabinzohn, P., Beinglass, I.

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SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE von Beinglass, Israel, Or-Bach, Zvi, Sekar, Deepak C, Wurman, Zeev, Cronquist, Brian

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Semiconductor memory device and structure von Or-Bach Zvi, Cronquist Brian, Wurman Zeev, Sekar Deepak C, Beinglass Israel

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3d integrated circuit von OR-BACH, ZVI, SEKAR, DEEPAK C, CRONQUIST, BRIAN, BEINGLASS, ISRAEL, DE JONG, J. L, WURMAN, ZEEV

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Semiconductor device and structure von Or-Bach Zvi, Cronquist Brian, Wurman Zeev, Sekar Deepak C, Beinglass Israel

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