High precision two-dimensional strain mapping in semiconductor devices using nanobeam electron diffraction in the transmission electron microscope von Baumann, Frieder H.

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Extension of CD-TEM Towards 3D Elemental Mapping von Baumann, Frieder H., Popielarski, Brian, Lu, Yinggang, Mitchell, Travis

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Towards Routine EDX Tomography in Semiconductor Failure Analysis von Baumann, Frieder H., Popielarski, Brian, Mitchell, Travis, Lu, Yinggang

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Characterization of VLSI Processing Defects Using STEM-EELS Tomography von Baumann, Frieder H., Miller, John, Rhoads, Bryan, Friedman, Anne, Fu, Bianzhu

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Practical Considerations in Quantitative Nanoscale Energy-Dispersive X-ray Spectroscopy (EDX) and Its Application in SiGe von Weng, Weihao, Baumann, Frieder H., Ke, Yue, Loesing, Rainer, Madan, Anita, Zhu, Zhengmao, Katnani, Ahmad D.

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Combine TEM with TCAD Simulation - A Novel Approach in Failure Analysis von Zhang, Yu, Kodali, Satish, Banghart, Edmund, Mitchell, Travis, Baumann, Frieder

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Very low angle annular dark field imaging in the scanning transmission electron microscope: A versatile tool for micro- and nano-characterization von Baumann, Frieder H.

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Innovative Grounding Methodology for Epoxy Impregnated Semiconductor Cross Sections for Electron Microscopy Inspection von Baumann, Frieder, Pichumani, Pradip Sairam, Torcedo, Christopher

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Optimization of EDX Tomography Acquisition Geometry for Electronic Device Characterization von Baumann, Frieder, Mitchell, Travis, Utess, Dirk, Hobert, Christian

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A Case-Study of Bubble Formation Mechanism by Analytical TEM during Evaluation of an Incoming Spin-On-Hardmask at Wafer-Foundries von Zhao, Wayne W., Baumann, Frieder

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Development of Ultra-thin TEM Lamella Preparation Technique and Its Application in Failure Analysis von Zhang, Yu, Popielarski, Brian, Davidson, Kevin, Men, Long, Zhao, Wayne, Baumann, Frieder

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Challenges of nickel silicidation in CMOS technologies von Breil, Nicolas, Lavoie, Christian, Ozcan, Ahmet, Baumann, Frieder, Klymko, Nancy, Nummy, Karen, Sun, Bing, Jordan-Sweet, Jean, Yu, Jian, Zhu, Frank, Narasimha, Shreesh, Chudzik, Michael

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Structural characterization of tantalum nitride films as wet etch stop layer in advanced multiwork function metal gate MOSFETs von Mennell, Petra, Parvaneh, Hamed, Bayindir, Zeynel, Kang, Dong Hun, Baumann, Frieder, Madan, Anita, Bello, Abner, Shalini, Ashawaraya, Klare, Mark

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How to Avoid Artifacts in Nanobeam Diffraction Strain Measurements von Fu, B., Gribelyuk, M., Baumann, Frieder H., Wang, Yun-yu

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Moisture Uptake Impact on Damage Layer of Porous Low-k Film in 80nm-Pitched Cu Interconnects von Tagami, Masayoshi, Ogino, Atsushi, Miyajima, Hideshi, Shobha, Hosadurga, Baumann, Frieder H., Ito, Fuminori, Spooner, Terry

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Advances in Elemental Electron Tomography for the State-of-the-art Semiconductor Devices and Circuits Characterization and Failure Analysis von Fu, B., Gribelyuk, M, Baumann, Frieder H., Fang, C., Zhao, Wayne, Chen, E., Brooks, I.

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Lattice Monte Carlo models of thin film deposition von Gilmer, George H., Huang, Hanchen, de la Rubia, Tomas Diaz, Dalla Torre, Jacques, Baumann, Frieder

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Analyzing strain distribution in semiconductor structures using nano-beam diffraction von BAUMANN FRIEDER H

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Simulation of physical vapor deposition into trenches and vias: Validation and comparison with experiment von O’Sullivan, Peter L., Baumann, Frieder H., Gilmer, George H.

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ANALYZING STRAIN DISTRIBUTION IN SEMICONDUCTOR STRUCTURES USING NANO-BEAM DIFFRACTION von BAUMANN FRIEDER H

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