High reliability of 0.1 mu m InGaAs/InAlAs/InP high electron mobility transistors microwave monolithic integrated circuit on 3-inch InP substrates von Chou, Yeong-Chang, Leung, Denise, Lai, Richard, Grundbacher, Ron, Scarpulla, John, Barsky, Mike, Nishimoto, Matt, Eng, David, Liu, Po-Hsin, Oki, Aaron, Streit, Dwight

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An indium phosphide MMIC amplifier for 180-205 GHz von Archer, J.W., Lai, R., Grundbacher, R., Barsky, M., Tsai, R., Reid, P.

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End Point Detection of GaAs Backside Via Etching in Capacitor on Via von Nam, Peter, Luo, Wen-Ben, Zeng, Xianglin, Wang, J., Uyeda, Jansen, Biedenbender, Mike, Farkas, David, Barsky, Mike, Olson, Scott, Yajima, M., Dai, Fred

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Advanced InP and GaAs HEMT MMIC technologies for MMW commercial products von Barsky, M., Biedenbender, M., Xiaobing Mei, Po-Hsin Liu, Lai, R.

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S-MMIC InP HEMT Amplifiers Enabled by the Advanced InP Backside Processes von Zhou, Joe, Mei, Xiaobing, Elmadjian, Raffi, Geiger, Craig, Zeng, Xianglin, Cheung, Chi, Dai, Fred, Johnson, Roosevelt, Luo, Ke, Wang, J., Uyeda, Jansen, Warner, Bryce, Barsky, Mike, Olson, Scott, Dean, William, Radisic, Vesna, Lai, Richard

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Manufacturable and Reliable 0.1 μm AlSb/InAs HEMT MMIC Technology for Ultra-Low Power Applications von Yeong-Chang Chou, Yang, J.M., Lin, C.H., Lee, J., Lange, M., Tsai, R., Nam, P., Nishimoto, M., Gutierrez, A., Quach, H., Lai, R., Farkas, D., Wojtowicz, M., Chin, P., Barsky, M., Oki, A., Boos, J.B., Bennett, B.R.

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High performance and high reliability InP HEMT low noise amplifiers for phased-array applications von Grundbacher, R., Yeong-Chang Chou, Lai, R., Kwan Ip, Kam, S., Barsky, M., Hayashibara, G., Leung, D., Eng, D., Tsai, R., Nishimoto, M., Block, T., Po-Hsin Liu, Oki, A.

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High Reliability of 0.1 µm InGaAs/InAlAs/InP High Electron Mobility Transistors Microwave Monolithic Integrated Circuit on 3-inch InP Substrates von Chou, Yeong-Chang, Leung, Denise, Lai, Richard, Grundbacher, Ron, Scarpulla, John, Barsky, Mike, Nishimoto, Matt, Eng, David, Liu, Po-Hsin, Oki, Aaron, Streit, Dwight

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POLYMER VIA ETCHING PROCESS von WANG, JENNIFER, BARSKY, MIKE

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POLYMER VIA ETCHING PROCESS von WANG, JENNIFER, BARSKY, MIKE

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POLYMER VIA ETCHING PROCESS von WANG, JENNIFER, BARSKY, MIKE

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Polymer via etching process von WANG JENNIFER, BARSKY MIKE

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Dry etching process for compound semiconductors von WANG JENNIFER, BARSKY MIKE, SHENG HUAI-MIN

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Dry etching process for compound semiconductors von Wang, Jennifer, Sheng, Huai-Min, Barsky, Mike

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Compound Semiconductor Technology at NGST von Chen, Yaochung, Lai, Richard, Wojtowicz, Mike, Gutierrez, Augusto, Barsky, Mike, Elliott, Jeff, Block, Tom, Oki, Aaron, Streit, Dwight

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DRY ETCHING PROCESS FOR COMPOUND SEMICONDUCTORS von WANG, JENNIFER, SHENG, HUAI-MIN, BARSKY, MIKE

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DRY ETCHING PROCESS FOR COMPOUND SEMICONDUCTORS von WANG, JENNIFER, SHENG, HUAI-MIN, BARSKY, MIKE

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DRY ETCHING PROCESS FOR COMPOUND SEMICONDUCTORS von WANG, JENNIFER, SHENG, HUAI-MIN, BARSKY, MIKE

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Dry etching process for compound semiconductors von WANG JENNIFER, BARSKY MIKE, SHENG HUAI-MIN

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End Point Detection of GaAs Backside Via Etching in Capacitor on Via von Nam, Peter, Luo, Wen-Ben, Zeng, Xianglin, Wang, J., Uyeda, Jansen, Biedenbender, Mike, Farkas, David, Barsky, Mike, Olson, Scott

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