Winter Wheat Grain Quality, Zinc and Iron Concentration Affected by a Combined Foliar Spray of Zinc and Iron Fertilizers von Niyigaba, Etienne, Twizerimana, Angelique, Mugenzi, Innocent, Ngnadong, Wansim Aboubakar, Ye, Yu Ping, Wu, Bang Mo, Hai, Jiang Bo

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Vascular NRP2 triggers PNET angiogenesis by activating the SSH1-cofilin axis von Luo, Xi, He, Jiang-Yi, Xu, Jie, Hu, Shao-Yi, Mo, Bang-Hui, Shu, Qiu-Xia, Chen, Can, Gong, Yu-Zhu, Zhao, Xiao-Long, Xie, Gan-Feng, Yu, Song-Tao

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Prenatal inflammation exposure-programmed hypertension exhibits multi-generational inheritance via disrupting DNA methylome von Guan, Xiao, Dan, Guo-rong, Yang, Yao, Ji, Yan, Lai, Wen-jing, Wang, Fang-jie, Meng, Meng, Mo, Bang-hui, Huang, Pei, You, Ting-ting, Deng, Ya-fei, Song, Liang, Guo, Wei, Yi, Ping, Yu, Jian-hua, Gao, Yuan, Shou, Wei-nian, Chen, Bing-bo, Deng, You-cai, Li, Xiao-hui

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Authentication of Chinese Crude Drug Gecko by DNA Barcoding von Gu, Hai-Feng, Xia, Yun, Peng, Rui, Mo, Bang-Hui, Li, Li, Zeng, Xiao-Mao

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Improvement of RCA transistor using RTA annealing after the formation of interfacial oxide von Chun, Zhang Li, Yan, Jin Hai, Fei, Ye Hong, Zhi, Gao Yu, Jun, Ning Bao, Xian, Mo Bang

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Membrane-based solvent extraction for selective removal and recovery of metals von Bang Mo, Kim

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CONCRETE BLOCK FOR RETAINING WALL MANUFACTURING METHOD AND CONSTRUCTION METHOD THEREOF von KIM, BANG MO

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INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME von Fountain Jr., Gaius Gillman, Bang, Kyong-Mo, Haba, Belgacem

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Microelectronic packages having stacked die and wire bond interconnects von Bang, Kyong-Mo, Haba, Belgacem

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Stackable microelectronic package structures von Bang, Kyong-Mo, Haba, Belgacem

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INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME von HABA, Belgacem, BANG, Kyong-Mo, FOUNTAIN JR., Gaius Gillman

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ELECTRONIC DEVICE COOLING STRUCTURES von HABA, Belgacem, ZHANG, Ron, BANG, Kyong-Mo, FOUNTAIN, Gaius, WORKMAN, Thomas

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ELECTRONIC DEVICE COOLING STRUCTURES von HABA, Belgacem, ZHANG, Ron, FOUNTAIN, JR., Gaius Gillman, BANG, Kyong-Mo, WORKMAN, Thomas

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STACKABLE MICROELECTRONIC PACKAGE STRUCTURES von Bang, Kyong-Mo, Haba, Belgacem

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MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONNECTS von HABA, Belgacem, BANG, Kyong-Mo

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Stackable microelectronic package structures von Haba Belgacem, Bang Kyong-Mo

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BONDED STRUCTURES von GUEVARA, Gabriel, Z, MIRKARIMI, Laura, Wills, UZOH, Cyprian, Emeka, FOUNTAIN, Gaius, Gillman, Jr, GAO, Guilian, BANG, Kyong-Mo, KATKAR, Rajesh, WORKMAN, Thomas, THEIL, Jeremy, Alfred

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MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONNECTS von HABA, Belgacem, BANG, Kyong-Mo

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MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONNECTS von Haba Belgacem, Bang Kyong-Mo

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HIGH-BANDWIDTH MEMORY APPLICATION WITH CONTROLLED IMPEDANCE LOADING von SUN, Zhuowen, CHEN, Yong, BANG, Kyong-Mo

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