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  1. 1
    Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness

    Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness von Babinski Kyle, Moon Matthew D, Goddard Shawn R, DeMuynck David A, Schneider Craig E, Adderly Shawn A, Roma Melissa J, Delibac Daniel A

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  2. 2
    METHOD OF FINE-TUNING PROCESS CONTROLS DURING INTEGRATED CIRCUIT CHIP MANUFACTURING BASED ON SUBSTRATE BACKSIDE ROUGHNESS

    METHOD OF FINE-TUNING PROCESS CONTROLS DURING INTEGRATED CIRCUIT CHIP MANUFACTURING BASED ON SUBSTRATE BACKSIDE ROUGHNESS von DEMUYNCK DAVID A, ADDERLY SHAWN A, BABINSKI KYLE, SCHNEIDER CRAIG E, GODDARD SHAWN R, DELIBAC DANIEL A, MOON MATTHEW D, ROMA MELISSA J

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  3. 3
    Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness

    Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness von DEMUYNCK DAVID A, ADDERLY SHAWN A, BABINSKI KYLE, SCHNEIDER CRAIG E, GODDARD SHAWN R, DELIBAC DANIEL A, MOON MATTHEW D, ROMA MELISSA J

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