Preventing Void Growth Between Ni3Sn4 and Solder von Njuki, M., Thekkut, S., Das, R., Borgesen, P., Dimitrov, N.

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Stress evolution due to electromigration in confined metal lines von KORHONEN, M. A, BØRGESEN, P, TU, K. N, CHE-YU LI

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Understanding and preventing Cu–Sn micro joint defects through design and process control von Njuki, M., Thekkut, S., Das, R., Shahane, N., Thompson, P., Mirpuri, K., Borgesen, P., Dimitrov, N.

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Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue von Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., Borgesen, P.

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Solder joint reliability under realistic service conditions von Borgesen, P., Hamasha, S., Obaidat, M., Raghavan, V., Dai, X., Meilunas, M., Anselm, M.

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Effects of Thermal Cycling on Creep of SnAgCu Solder Joints von Alghoul, T., Wentlent, L., Sivasubramony, R., Greene, C., Thompson, P., Borgesen, P.

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Nanocopper Based Solder-Free Electronic Assembly von Schnabl, K., Wentlent, L., Mootoo, K., Khasawneh, S., Zinn, A. A., Beddow, J., Hauptfleisch, E., Blass, D., Borgesen, P.

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Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu von Wafula, F., Yin, L., Borgesen, P., Andala, D., Dimitrov, N.

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Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder von LEHMAN, L. P, ATHAVALE, S. N, XING, Y, ZAVALIJ, L, BORGESEN, P, COTTS, E. J, FULLEM, T. Z, GIAMIS, A. C, KINYANJUI, R. K, LOWENSTEIN, M, MATHER, K, PATEL, R, RAE, D, WANG, J

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Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints von Meilunas, M., Borgesen, P.

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Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses von KORHONEN, M. A, BØRGESEN, P, BROWN, D. D, CHE-YU LI

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Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface von Liu, Y, Wang, J, Yin, L, Kondos, P, Parks, C, Borgesen, P, Henderson, D W, Cotts, E J, Dimitrov, N

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Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell von Wafula, F., Liu, Y., Yin, L., Borgesen, P., Cotts, E. J., Dimitrov, N.

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The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure von ZRIBI, A, CLARK, A, ZAVALIJ, L, BORGESEN, P, COTTS, E. J

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Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies von Borgesen, P, Blass, D, Meilunas, M

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Interactions Between Flip Chip Underfill and Solder Alloy von Blass, D, Borgesen, P

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Thermal-stress-induced voiding in narrow, passivated Cu lines von BØRGESEN, P, LEE, J. K, GLEIXNER, R, LI, C.-Y

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Enhanced voiding in Cu-Sn micro joints von Njuki, M., Thekkut, S., Sivasubramony, R., Greene, C.M., Shahane, N., Thompson, P., Mirpuri, K., Borgesen, P., Dimitrov, N.

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Do thermal spikes contribute to the ion-induced mixing of Ni into Zr, Ti, and Pd ? von BOÊRGESEN, P, LILIENFELD, D. A, JOHNSON, H. H

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On the Incorporation of Fine Pitch Lead Free CSPs in High Reliability SnPb Based Microelectronics Assemblies von Blass, D, Meilunas, M, Borgesen, P

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