Biological studies and electrical conductivity of paper sheet based on PANI/PS/Ag-NPs nanocomposite von Youssef, A.M., Mohamed, S.A., Abdel-Aziz, M.S., Abdel-Aziz, M.E., Turky, G., Kamel, S.

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Stencil printing process performance on various aperture size and optimization for lead-free solder paste von Rusdi, M. S., Abdullah, M. Z., Chellvarajoo, S., Abdul Aziz, M. S., Abdullah, M. K., Rethinasamy, P., Veerasamy, Sivakumar, Santhanasamy, Damian G.

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Effect of filling level and fillet profile on pin-through-hole solder joint von Ishak, M. H. H., Abdul Aziz, M. S., Ismail, Farzad, Khor, C. Y., Abdullah, M. Z., Abas, Aizat

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Foliar Application of Different Iron Sources Improves Morpho-Physiological Traits and Nutritional Quality of Broad Bean Grown in Sandy Soil von Mahmoud, Abdel Wahab M, Ayad, Amira A, Abdel-Aziz, Hend S. M, Williams, Leonard L, El-Shazoly, Rasha M, Abdel-Wahab, Ahmed, Abdeldaym, Emad A

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Immobilization of low and intermediate level of organic radioactive wastes in cement matrices von Eskander, S.B., Abdel Aziz, S.M., El-Didamony, H., Sayed, M.I.

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Optimization of 3D IC stacking chip on molded encapsulation process: a response surface methodology approach von Ishak, M. H. H., Ismail, Farzad, Aziz, M. S. Abdul, Abdullah, M. Z., Abas, Aizat

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CFD modeling of pin shape effects on capillary flow during wave soldering von Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Jalar, A., Che Ani, F.

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Chip morphology in ball nose end milling process of nickel-based alloy material under MQL condition von Kasim, M. S., Hafiz, M. S. A., Ghani, J. A., Haron, C. H. C., Izamshah, R., Aziz, M. S. A., Mohamad, W. N. F., Wong, P. K., Saedon, J.

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Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis von Abdul Aziz, M. S., Khor, C. Y., Abdullah, M. Z.

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Infrared absorption spectra of transition metals-doped soda lime silica glasses von Khalil, E.M.A., ElBatal, F.H., Hamdy, Y.M., Zidan, H.M., Aziz, M.S., Abdelghany, A.M.

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Influence of solder bump arrangements on molded IC encapsulation von Khor, C.Y., Abdullah, M.Z., Lau, Chun-Sean, Leong, W.C., Abdul Aziz, M.S.

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Current transport mechanisms and photovoltaic properties of tetraphenylporphyrin/n-type silicon heterojunction solar cell von El-Nahass, M.M., Zeyada, H.M., Aziz, M.S., Makhlouf, M.M.

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Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach von Aziz, M.S. Abdul, Abdullah, M.Z., Khor, C.Y., Ani, F. Che

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Morphological, electrical & antibacterial properties of trilayered Cs/PAA/PPy bionanocomposites hydrogel based on Fe3O4-NPs von Youssef, A.M., Abdel-Aziz, M.E., El-Sayed, E.S.A., Abdel-Aziz, M.S., Abd El-Hakim, A.A., Kamel, S., Turky, G.

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Effect of Wing Deformation on the Aerodynamic Performance of Flapping Wings: Fluid-Structure Interaction Approach von Fairuz, Z. M, Abdullah, M. Z, Zubair, M, Abdul Mujeebu, M, Abdullah, M. K, Yusoff, H, Abdul Aziz, M. S

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Gold nanoparticle trapping and delivery for therapeutic applications von Aziz, M S, Suwanpayak, Nathaporn, Jalil, Muhammad Arif, Jomtarak, R, Saktioto, T, Ali, Jalil, Yupapin, P P

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Preparation and characterization of chitosan/polyacrylic acid/copper nanocomposites and their impact on onion production von Abd El-Aziz, M.E., Morsi, S.M.M., Salama, Dina M., Abdel-Aziz, M.S., Abd Elwahed, Mohamed S., Shaaban, E.A., Youssef, A.M.

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Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering von Aziz, M. S. Abdul, Abdullah, M. Z., Khor, C. Y., Fairuz, Z. M., Iqbal, A. M., Mazlan, M., Rasat, Mohd Sukhairi Mat

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Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach von Aziz, M S Abdul, Abdullah, M Z, Khor, C Y, Ani, F Che, Adam, N H

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Molecular buffer using a PANDA ring resonator for drug delivery use von Suwanpayak, N, Jalil, M A, Aziz, M S, Ali, J, Yupapin, P P

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