Piezoresistive Effect in Plasma-Doping of Graphene Sheet for High-Performance Flexible Pressure Sensing Application von Haniff, M. A. S. M, Hafiz, S. M, Huang, N. M, Rahman, S. A, Wahid, K. A. A, Syono, M. I, Azid, I. A

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Effects of hybrid fillers based on micro- and nano-sized silver particles on the electrical performance of epoxy composites von Zulkarnain, M., Mariatti, M., Azid, I. A.

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Effects of Silver Microparticles and Nanoparticles on Thermal and Electrical Characteristics of Electrically Conductive Adhesives von Zulkarnain, M., Fadzil, M. A., Mariatti, M., Azid, I. A.

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Recent fluid–structure interaction modeling challenges in IC encapsulation – A review von Khor, C.Y., Abdullah, M.Z., Lau, Chun-Sean, Azid, I.A.

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Fast transient thermal analysis of Fourier and non-Fourier heat conduction von Loh, J.S., Azid, I.A., Seetharamu, K.N., Quadir, G.A.

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Particle Arrangement Design for Predicting the Percolation Threshold of Silver/Epoxy Composite for Electrically Conductive Adhesive Application von Zulkarnain, M., Husaini, Muhammad, Mariatti, M., Azid, I. A.

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Emission control in palm oil mills using artificial neural network and genetic algorithm von Ahmad, A.L., Azid, I.A., Yusof, A.R., Seetharamu, K.N.

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The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements von Lim, C. H., Abdullah, M. Z., Azid, I. A., Khor, C. Y.

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Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms von Jeevan, K, Quadir, G.A, Seetharamu, K.N, Azid, I.A

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Optimization of thermal resistance of stacked micro-channel using genetic algorithms von Jeevan, K, Quadir, G.A, Seetharamu, K.N, Azid, I.A, Zainal, Z.A

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An evolutionary approach for layout optimization of a three-dimensional truss von AZID, I. A, KWAN, A. S. K, SEETHARAMU, K. N

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A GA-based technique for layout optimization of truss with stress and displacement constraints von Azid, I. A., Kwan, A. S. K., Seetharamu, K. N.

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Determination of Young's modulus of epoxy coated polyethylene micro-cantilever using phase-shift shadow moiré method von Lim, J.H., Ratnam, M.M., Azid, I.A., Mutharasu, D.

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Particle Dispersion Model for Predicting the Percolation Threshold of Nano-Silver Composite von Zulkarnain, M., Muhamad Husaini, A. B., Mariatti, M., Azid, I. A.

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The effect of radius/height ratio on truss optimization von Azid, I.A., Kwan, A.S.K., Seetharamu, K.N.

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Optimization of fins used in electronic packaging von Eu Ong, Kang, Oon Lee, Kor, Seetharamu, K.N, Azid, I.A, Quadir, G.A, Zainal, Z.A, Joo Goh, Teck

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Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life von Lee, K.O, Ong, K.E, Seetharamu, K.N, Azid, I.A, Quadir, G.A, Goh, T.J

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Deflection Measurement and Determination of Young’s Modulus of Micro-cantilever Using Phase-shift Shadow Moiré Method von Lim, J. H., Ratnam, M. M., Azid, I. A., Mutharasu, D.

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Neuro-genetic optimization of micro compact heat exchanger von Lee, H.W, Teng, Y.J, Azid, I.A, Seetharamu, K.N

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Heat transfer enhancement by flexible printed circuit board's deformation von Lim, C.H., Abdullah, M.Z., Azid, I.A., Khor, C.Y.

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