Controlling plasma charge damage in advanced semiconductor manufacturing. Challenge of small feature size device, large chip size, and large wafer size von Aum, P.K., Brandshaft, R., Brandshaft, D., Dao, T.B.

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Non-destructive Prognosis Method Of Oxide Degradation- A Rapid Monitoring Of Oxide Energy Band Changes Cause By Semiconductor Processing von Aum, P.K., Thuy Dao

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ULSI circuit design trend, technology road map, and test structures for process-induced damage von Dao, T.B., Aum, P.K.

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Process induced damages from various integrated circuit interconnection designs - limitations of antenna rule under practical integrated circuit layout practice von Mercier, J., Dao, T., Flechner, H., Jean, B., Oscar, D.B., Aum, P.K.

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Non-destructive prognosis method of oxide degradation: a rapid monitoring of oxide energy band changes caused by semiconductor processing von Aum, P.K., Dao, T.B.

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