Stress analyses of high spatial resolution on TSV and BEoL structures von Vogel, D., Auerswald, E., Auersperg, J., Bayat, P., Rodriguez, R.D., Zahn, D.R.T., Rzepka, S., Michel, B.

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On the crack and delamination risk optimization of a Si-interposer for LED packaging von Auersperg, J., Dudek, R., Jordan, R., Bochow-Neß, O., Rzepka, S., Michel, B.

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Characterisation of Strength Behaviour of Aluminium Foam Sandwiches Under Static Load von Vogel, J., Keller, J., Sviridov, A., Feige, H.-J., Kreyssig, K., Auersperg, J., Plass, P., Walter, H.

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Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections von Dreßler, M., Becker, K-F., Wunderle, B., Auersperg, J., Reichl, H.

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Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor von Auersperg, J., Collet, C., Dean, Th, Vogel, D., Winkler, Th

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Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor von Auersperg, J., Auerswald, E., Collet, C., Dean, Th, Vogel, D., Winkler, Th, Rzepka, S.

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FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation von Auerswald, E., Sabate, N., Vogel, Dietmar, Gollhardt, A., Keller, J., Michel, Bernd, Auersperg, J.

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Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches von Auersperg, J, Kieselstein, E, Schubert, A, Michel, B

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Modular parametric finite element modelling for reliability-studies in electronic and mems packaging von WUNDERLE, B, AUERSPERG, J, GROSSER, V, KAULFERSCH, E, WITTIER, O, MICHEL, B

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VCCT and integral concepts of bi-material interface fracture in low-k structures - Going to understand relation von Auersperg, J, Dudek, R, Michel, B

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Interaction integral and mode separation for BEoL-cracking and -delamination investigations under 3D-IC integration aspects von Auersperg, J, Dudek, R, Oswald, J, Michel, B

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Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks von Auersperg, J., Rzepka, S., Michel, B.

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Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds von Shirangi, H., Auersperg, J., Koyuncu, M., Walter, H., Muller, W.H., Michel, B.

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Crack and damage in low-k BEoL stacks under assembly and CPI aspects von Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B

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Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects von Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B

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Fracture mechanics based crack and delamination risk evaluation and RSM/DOE concepts for advanced microelectronics applications von Auersperg, J., Seiler, B., Cadalen, E., Dudek, R., Michel, B.

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SAW sensors for high temperature applications von Mrosk, J.W., Ettl, C., Berger, L., Dabala, P., Fecht, H.J., Fischerauer, G., Hornsteiner, J., Riek, K., Riha, E., Born, E., Werner, M., Dommann, A., Auersperg, J., Kieselstein, E., Michel, B., Mucha, A.

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Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches von Auersperg, J., Vogel, D., Michel, B.

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Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging von Topper, M., Auersperg, J., Glaw, V., Kaskoun, K., Prack, E., Keser, B., Coskina, P., Jager, D., Fetter, D., Ehrmann, O., Samulewicz, K., Meinherz, C., Fehlberg, S., Karduck, C., Reichl, H.

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Erinnerungen an meinen Vater Vincenz Carl Fürst von Auersperg. Hrsg. von F.J.A von Auersperg, F. J

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