Electrodeposition of copper thin film on ruthenium: A potential diffusion barrier for Cu interconnects von CHYAN, Oliver, ARUNAGIRI, Tiruchirapalli N, PONNUSWAMY, Thomas

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5 nm ruthenium thin film as a directly plateable copper diffusion barrier von Arunagiri, T. N., Zhang, Y., Chyan, O., El-Bouanani, M., Kim, M. J., Chen, K. H., Wu, C. T., Chen, L. C.

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Interfacial Diffusion Studies of Cu/(5 nm Ru)/Si Structures Physical Vapor Deposited vs Electrochemically Deposited Cu von Arunagiri, Tiruchirapalli N, Zhang, Yibin, Chyan, Oliver, Kim, Moon J, Hurde, Trace Q

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P073 - The Wolverhampton Assessment Tool (WAT): An objective and reproducible PRO to monitor wellbeing and detect clinical progression in prostate cancer patients von Sayers, I., Rogers, J., Menon, A., Arunagiri, N., Mohindru, G., Tovee, J., Matheson, D.

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The Wolverhampton Assessment Tool (WAT): An objective and reproducible PRO to monitor wellbeing and detect clinical progression in prostate cancer patients von Sayers, I., Rogers, J., Menon, A., Arunagiri, N., Mohindru, G., Tovee, J., Matheson, D.

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Electrodeposition of Copper Thin Film on Ruthenium von Chyan, Oliver, Arunagiri, Tiruchirapalli N., Ponnuswamy, Thomas

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Diffusion studies of copper on ruthenium thin film a plateable copper diffusion barrier von Chan, R, Arunagiri, T N, Zhang, Y, Chyan, O, Wallace, R M, Kim, M J, Kur, T Q

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Underpotential Deposition of Copper on Electrochemically Prepared Conductive Ruthenium Oxide Surface von Zhang, Yibin, Huang, Long, Arunagiri, Tiruchirapalli N., Ojeda, Oscar, Flores, Sarah, Chyan, Oliver, Wallace, Robert M.

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Interfacial Diffusion Studies of Cu∕(5 nm Ru)∕Si Structures von Arunagiri, Tiruchirapalli N., Zhang, Yibin, Chyan, Oliver, Kim, Moon J., Hurd, Trace Q.

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Interfacial Characterization of Electrodeposited Cu on 5-10 nm Ru Films Supported by Low-k Dielectrics von Nalla, Praveen Reddy, Tiruchirapalli N, Arunagiri, Chyan, Oliver, Hurd, Trace

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Spectroscopic Investigations of M(CO)5-C60 (M = W, MO) Complexes: Precursors for Metal Fullerides von Resmi, M. R., Smitha, K., Arunagiri, T. N., Pradeep, T.

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METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS von ARUNAGIRI, TIRUCHIRAPALLI, N, LI, SHIJIAN, KOLICS, ARTUR, K

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Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process von LI SHIJIAN, ARUNAGIRI TIRUCHIRAPALLI N, KOLICS ARTUR K

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Cells Deploy a Two-Pronged Strategy to Rectify Misfolded Proinsulin Aggregates von Cunningham, Corey N., Williams, Jeffrey M., Knupp, Jeffrey, Arunagiri, Anoop, Arvan, Peter, Tsai, Billy

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METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS von ARUNAGIRI, TIRUCHIRAPALLI, N, LI, SHIJIAN, KOLICS, ARTUR, K

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METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS von ARUNAGIRI, TIRUCHIRAPALLI, N, LI, SHIJIAN, KOLICS, ARTUR, K

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METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS von ARUNAGIRI, TIRUCHIRAPALLI, N, LI, SHIJIAN, KOLICS, ARTUR, K

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Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating Process von LI SHIJIAN, ARUNAGIRI TIRUCHIRAPALLI N, KOLICS ARTUR K

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Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process von LI SHIJIAN, ARUNAGIRI TIRUCHIRAPALLI N, KOLICS ARTUR K

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Misfolded proinsulin in the endoplasmic reticulum during development of beta cell failure in diabetes von Arunagiri, Anoop, Haataja, Leena, Cunningham, Corey N., Shrestha, Neha, Tsai, Billy, Qi, Ling, Liu, Ming, Arvan, Peter

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