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  1. 1
    Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages

    Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages von ARNAUDOV, Radosvet G


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  2. 2
    Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

    Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs von Arnaudov, Radosvet G.

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  3. 3
    Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs

    Some considerations of via stitching impact on parasitic coupling of RF multiports in multilayer packages and MCMs von Arnaudov, Radosvet G.

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  4. 4
    Simple extraction of effective dielectric permittivity and magnetic permeability in IC transmission lines on multilayer substrates

    Simple extraction of effective dielectric permittivity and magnetic permeability in IC transmission lines on multilayer substrates von Arnaudov, R. G., Borisov, R. B.

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  5. 5
    Study of microwave electromagnetic radiation in multilayer QFN package

    Study of microwave electromagnetic radiation in multilayer QFN package von Arnaudov, R G, Plavskiy, L G

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  6. 6
    Calculation of multimode property of MW resonator

    Calculation of multimode property of MW resonator von Arnaudov, R G, Plavsky, L G

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  7. 7
    Investigation of parasitic electromagnetic radiation in multilayer packages and MCMs

    Investigation of parasitic electromagnetic radiation in multilayer packages and MCMs von Arnaudov, R.G., Baev, S.R., Avdjiiski, B.G.


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  8. 8
    Characteristics of passive Ta-resistive planes embedded in Al-sheet "PCB" - compatible for integrated MCM-substrates or packaging carriers

    Characteristics of passive Ta-resistive planes embedded in Al-sheet "PCB" - compatible for integrated MCM-substrates or packaging carriers von Ivanov Philippov, Philip, Markova Rassovska, Milka, Georgiev Arnaudov, Radosvet, Angelov Ianev, Vassil, Draganova Gospodinova, Minka

    Veröffentlicht in Microelectronics international

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