Advances in Electronic Interconnection Materials von Gourlay, C. M., Arfaei, B.

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Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints von Arfaei, B, Benedict, M, Cotts, E J

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature von Arfaei, B., Kim, N., Cotts, E.J.

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Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony von Belyakov, S. A., Coyle, R. J., Arfaei, B., Xian, J. W., Gourlay, C. M.

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Influence of equal-channel angular pressing on the microstructure and corrosion behaviour of a 6xxx aluminium alloy for automotive conductors von Rochet, C., Veron, M., Rauch, E.F., Lowe, T.C., Arfaei, B., Laurino, A., Harouard, J.P., Blanc, C.

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Influence of equal-channel angular pressing on the corrosion fatigue behaviour of an Al-Mg-Si aluminium alloy for automotive conductors von Rochet, C., Andrieu, E., Arfaei, B., Harouard, J.-P., Laurino, A., Lowe, T.C., Odemer, G., Blanc, C.

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Advances in electronic interconnection materials von Gourlay, CM, Arfaei, B

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Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony von Belyakov, SA, Coyle, RJ, Arfaei, B, Xian, JW, Gourlay, CM

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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue von Yin, Liang, Wentlent, Luke, Yang, Linlin, Arfaei, Babak, Oasaimeh, Awni, Borgesen, Peter

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Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure von Arfaei, B., Wentlent, L., Joshi, S., Alazzam, A., Tashtoush, T., Halaweh, M., Chivukula, S., Yin, L., Meilunas, M., Cotts, E., Borgesen, P.

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies von ARFAEI, B, KIM, N, COTTS, E. J

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Dirac quantization of open strings and noncommutativity in branes von Ardalan, F., Arfaei, H., Sheikh-Jabbari, M.M.

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Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation von Jaradat, Y., Chen, J., Owens, J. E., Yin, L., Qasaimeh, A., Wentlent, L., Arfaei, B., Borgesen, P.

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Design and synthesis of new 1,2-diaryl-4,5,6,7-tetrahydro-1H-benzo[d] imidazoles as selective cyclooxygenase (COX-2) inhibitors von Zarghi, A., Reihanfard, H., Arfaei, S., Daraei, B., Hedayati, M.

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QFT Correction to Black Holes von Abedi, J., Arfaei, H., Bedroya, A., Noori Kuhani, M., Mehin-Rasulian, A., Vaziri Salehi, K.

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Mixed branes interaction in compact space-time von Arfaei, H., Kamani, D.

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Branes with back-ground fields in boundary state formalism von Arfaei, H., Kamani, D.

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Effects of varying amplitudes on the fatigue life of lead free solder joints von Obaidat, M., Hamasha, S., Jaradat, Y., Qasaimeh, A., Arfaei, B., Anselm, M., Borgesen, P.

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Double-horizon limit, AdS geometry and entropy function von Arfaei, Hessamaddin, Fareghbal, Reza

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Mixed branes at angle in compact spacetime von Arfaei, H., Kamani, D.

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