Silicon nanosprings fabricated by glancing angle deposition for ultra-compliant films and interfaces von Antartis, Dimitrios A., Mott, Ryan N., Chasiotis, Ioannis

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Si nanospring films for compliant interfaces von Antartis, Dimitrios A., Mott, Ryan N., Chasiotis, Ioannis

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Nanofibrillar Si Helices for Low-Stress, High-Capacity Li+ Anodes with Large Affine Deformations von Antartis, Dimitrios A, Wang, Haoran, Tang, Ching-Yen, Chew, Huck Beng, Dillon, Shen J, Chasiotis, Ioannis

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In situ X-ray micro-CT characterization of chemo-mechanical relaxations during Sn lithiation von Gonzalez, Joseph F., Antartis, Dimitrios A., Chasiotis, Ioannis, Dillon, Shen J., Lambros, John

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Cu Nanospring Films for Advanced Nanothermal Interfaces von Antartis, Dimitrios A., Mott, Ryan N., Das, Debashish, Shaddock, David, Chasiotis, Ioannis

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Residual stress and mechanical property measurements in amorphous Si photovoltaic thin films von Antartis, Dimitrios, Chasiotis, Ioannis

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Effect of porosity on electrochemical and mechanical properties of composite Li-ion anodes von Antartis, Dimitrios, Dillon, Shen, Chasiotis, Ioannis

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INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION von Lee, Han Ju, Antartis, Dimitrios, Pelto, Christopher, Kim, Gwang-Soo

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INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION von PELTO, Christopher, LEE, Han Ju, KIM, Gwang-Soo, ANTARTIS, Dimitrios

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TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER von PELTO, Christopher M, JAVVAJI, Vishal, RAORANE, Digvijay A, O'DAY, Michael P, CHOI, Seung-June, ANTARTIS, Dimitrios

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TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER von PELTO, Christopher M, RAORANE, Digvijay, JAVVAJI, Vishal, O'DAY, Michael P, CHOI, Seung-June, ANTARTIS, Dimitrios

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PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING von DAS, Adita, KARHADE, Omkar G, KRISHNATREYA, Bhaskar Jyoti, BRUN, Xavier Francois, JUN, Kimin, MATTHIESEN, John Edward Zeug, WIDODO, Trianggono, BHATIA, Mohit, KILAMBI, Harini, ELSHERBINI, Adel A, SURAPANENI, Rajesh, ANTARTIS, Dimitrios

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FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATED CIRCUIT DIES von Karhade, Omkar, Liff, Shawna, Shi, Yi, Mal, Siddhartha, Sarkar, Arnab, Antartis, Dimitrios, Dong, Siyan, Deshpande, Nitin A, Niazi, Haris Khan, Mallik, Debendra, Minn, Khant, Kim, Gwang-soo, Zhang, Botao

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FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATED CIRCUIT DIES von ZHANG, Botao, DONG, Siyan, ANTARTIS, Dimitrios, KIM, Gwang-soo, KARHADE, Omkar, NIAZI, Haris Khan, MALLIK, Debendra, DESHPANDE, Nitin A, MINN, Khant, SARKAR, Arnab, LIFF, Shawna, MAL, Siddhartha, SHI, Yi

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