Treffer 1 - 4 von 4 für Suche 'Ang Ye Cheah', Suchdauer: 0,53s Treffer weiter einschränken
  1. 1
    Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump

    Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump von Amin, Nowshad, Ang Ye Cheah, Lam Zi Yi, Kornain, Zainudin


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  2. 2
    An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA)

    An approach on underfill material selection for the low-k Flip Chip Plastic Ball Grid Array (FCPBGA) von Kornain, Zainudin, Amin, Nowshad, Ang Ye Cheah, Jalar, Azman


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  3. 3
    The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

    The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA von Amin, N., Ang Ye Cheah, Kornain, Z., Ahmad, I.

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  4. 4
    Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

    Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) von Kornain, Z., Amin, N., Jalar, A., Ang Ye Cheah, Ahmad, I.

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