Treffer 1 - 20 von 208 für Suche 'Amagai, Masazumi', Suchdauer: 0,93s Treffer weiter einschränken
  1. 1
    A study of nanoparticles in Sn–Ag based lead free solders

    A study of nanoparticles in Sn–Ag based lead free solders von Amagai, Masazumi


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  2. 2
    Mechanical characterization of Sn–Ag-based lead-free solders

    Mechanical characterization of Sn–Ag-based lead-free solders von Amagai, Masazumi, Watanabe, Masako, Omiya, Masaki, Kishimoto, Kikuo, Shibuya, Toshikazu


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  3. 3
    Characterization of chip scale packaging materials

    Characterization of chip scale packaging materials von Amagai, Masazumi


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  4. 4
    The effect of polyimide surface chemistry and morphology on critical stress intensity factor

    The effect of polyimide surface chemistry and morphology on critical stress intensity factor von Amagai, Masazumi


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  5. 5
    Over Molding Process Development for a Stacked Wafer-level Chip Scale Package with Through Silicon Vias (TSVs)

    Over Molding Process Development for a Stacked Wafer-level Chip Scale Package with Through Silicon Vias (TSVs) von Takahashi, Yoshimi, Dunne, Rajiv, Amagai, Masazumi, Koto, Yohei, Iriguchi, Shoichi, Bonifield, Tom, Steinmann, Philipp, Stepniak, David C.


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  6. 6
    Evaluation of Impact Strength due to Thermal Degradation for BGA-IC Package

    Evaluation of Impact Strength due to Thermal Degradation for BGA-IC Package von KIM, Youngbae, NOGUCHI, Hiroshi, AMAGAI, Masazumi


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  7. 7
    Mechanical reliability in electronic packaging

    Mechanical reliability in electronic packaging von Amagai, Masazumi


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  8. 8
    Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder

    Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder von Kim, YoungBae, Noguchi, Hiroshi, Amagai, Masazumi


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  9. 9
    Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package

    Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package von KIM, YoungBae, NOGUCHI, Hiroshi, AMAGAI, Masazumi


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  10. 10
    METHOD FOR FABRICATING A PACKAGE-ON-PACKAGE STACKED SEMICONDUCTOR DEVICE USING SN-AG-PT SOLDER BODIES

    METHOD FOR FABRICATING A PACKAGE-ON-PACKAGE STACKED SEMICONDUCTOR DEVICE USING SN-AG-PT SOLDER BODIES von AMAGAI, Masazumi

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  11. 11
    A Study of Nanoparticles in SnAg-Based Lead-Free Solders

    A Study of Nanoparticles in SnAg-Based Lead-Free Solders von Amagai, Masazumi

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  12. 12
    SEMICONDUCTOR DEVICE WITH IMPROVED SOLDER JOINT

    SEMICONDUCTOR DEVICE WITH IMPROVED SOLDER JOINT von AMAGAI, Masazumi

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  13. 13
    Tape carrier for device assembly and device assembly using a tape carrier

    Tape carrier for device assembly and device assembly using a tape carrier von AMAGAI, Masazumi, WATANABE, Masako

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  14. 14
    Fatigue Characteristics of Solder Joints in BGA-IC Package due to Vibration: 1st Report, Comparison of Package of Pb-free Solder Ball with That of Pb Solder Ball Under a Transverse Vibration

    Fatigue Characteristics of Solder Joints in BGA-IC Package due to Vibration: 1st Report, Comparison of Package of Pb-free Solder Ball with That of Pb Solder Ball Under a Transverse... von KIM, Young-Bae, NOGUCHI, Hiroshi, AMAGAI, Masazumi


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  15. 15
    Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package

    Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package von Kim, Youngbae, Noguchi, Hiroshi, Amagai, Masazumi


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  16. 16
    A study of package warpage for package on package (PoP)

    A study of package warpage for package on package (PoP) von Amagai, Masazumi, Suzuki, Yutaka


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  17. 17
    Unique adhesion testing and MSL modeling

    Unique adhesion testing and MSL modeling von Amagai, Masazumi, Takao, Kentaro


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  18. 18
    FAN-OUT SEMICONDUCTOR PACKAGE

    FAN-OUT SEMICONDUCTOR PACKAGE von Amagai, Masazumi, Kim, Ju Ho, KIM, Sung Han, Jeong, Tae Sung

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  19. 19
    Fan-out semiconductor package

    Fan-out semiconductor package von Amagai, Masazumi, Kim, Ju Ho, Kim, Sung Han, Jeong, Tae Sung

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  20. 20
    TSV stress testing and modeling

    TSV stress testing and modeling von Amagai, Masazumi, Suzuki, Yutaka


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