Microelectrochemical studies of pit initiation at single inclusions in Al 2024-T3 von SUTER, Thomas, ALKIRE, Richard C

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Nanopatterned and nanoparticle-modified electrodes von Alkire, Richard C, Bartlett, Philip N, Lipkowski, Jacek

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Stochastic Simulation of the Early Stages of Kinetically Limited Electrodeposition von Drews, Timothy O., Radisic, Aleksandar, Erlebacher, Jonah, Braatz, Richard D., Searson, Peter C., Alkire, Richard C.

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Electrochemical engineering in an age of discovery and innovation von Alkire, Richard C., Braatz, Richard D.

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Pit initiation at single sulfide inclusions in stainless steel. I. Electrochemical microcell measurements von WEBB, Eric G, ALKIRE, Richard C

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A hybrid multiscale kinetic Monte Carlo method for simulation of copper electrodeposition von Zheng, Zheming, Stephens, Ryan M., Braatz, Richard D., Alkire, Richard C., Petzold, Linda R.

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Additive-Assisted Nucleation and Growth by Electrodeposition von Stephens, Ryan M., Willis, Matthew, Alkire, Richard C.

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Coupled mesoscale-continuum simulations of copper electrodeposition in a trench von Drews, Timothy O., Webb, Eric G., Ma, David L., Alameda, Jay, Braatz, Richard D., Alkire, Richard C.

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Monte Carlo simulation of the electrodeposition of copper. I. Additive-free acidic sulfate solution von PRICER, Timothy J, KUSHNER, Mark J, ALKIRE, Richard C

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Evolution of surface roughness during copper electrodeposition in the presence of additives: Comparison of experiments and Monte Carlo simulations von DREWS, Timothy O, GANLEY, Jason C, ALKIRE, Richard C

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Multiscale systems engineering with applications to chemical reaction processes von Braatz, Richard D., Alkire, Richard C., Rusli, Effendi, Drews, Timothy O.

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Effect of Additives on Shape Evolution during Electrodeposition von Qin, Yan, Li, Xiaohai, Xue, Feng, Vereecken, Philippe M., Andricacos, Panayotis, Deligianni, Hariklia, Braatz, Richard D., Alkire, Richard C.

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Copper deposition in the presence of surface-confined additives von ELIADIS, E. D, NUZZO, R. G, GEWIRTH, A. A, ALKIRE, R. C

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Adsorption of thiourea on copper electrodes monitored by in situ infrared spectroscopy von PAPAPANAYIOTOU, D, NUZZO, R. N, ALKIRE, R. C

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The role of inclusions on initiation of crevice corrosion of stainless steel. I: Experimental studies von LOTT, S. E, ALKIRE, R. C

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Dieter M. Kolb (1942-2011) von Kibler, Ludwig A., Alkire, Richard C.

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Effect of benzotriazole on the anisotropic electrolytic etching of copper von PAPAPANAYIOTOU, D, DELIGIANNI, H, ALKIRE, R. C

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Evolution of Surface Roughness during Copper Electrodeposition in the Presence of Additives von Drews, Timothy O., Ganley, Jason C., Alkire, Richard C.

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Pit Initiation at Single Sulfide Inclusions in Stainless Steel von Webb, Eric G., Alkire, Richard C.

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Pit Initiation at Single Sulfide Inclusions in Stainless Steel von Webb, Eric G., Alkire, Richard C.

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