Editors' Choice-Perspective-Mathematical Modeling of Electrochemical Systems at Multiple Scales von Alkire, Richard

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An exact and efficient first passage time algorithm for reaction–diffusion processes on a 2D-lattice von Bezzola, Andri, Bales, Benjamin B., Alkire, Richard C., Petzold, Linda R.

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Microelectrochemical studies of pit initiation at single inclusions in Al 2024-T3 von SUTER, Thomas, ALKIRE, Richard C

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Nanopatterned and nanoparticle-modified electrodes von Alkire, Richard C, Bartlett, Philip N, Lipkowski, Jacek

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Pit initiation at single sulfide inclusions in stainless steel. I. Electrochemical microcell measurements von WEBB, Eric G, ALKIRE, Richard C

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Effect of Additives on Shape Evolution during Electrodeposition von Li, Xiaohai, Drews, Timothy O., Rusli, Effendi, Xue, Feng, He, Yuan, Braatz, Richard, Alkire, Richard

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Pit initiation at single sulfide inclusions in stainless steel. II. Detection of local pH, sulfide, and thiosulfate von WEBB, Eric G, ALKIRE, Richard C

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A hybrid multiscale kinetic Monte Carlo method for simulation of copper electrodeposition von Zheng, Zheming, Stephens, Ryan M., Braatz, Richard D., Alkire, Richard C., Petzold, Linda R.

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Stochastic Simulation of the Early Stages of Kinetically Limited Electrodeposition von Drews, Timothy O., Radisic, Aleksandar, Erlebacher, Jonah, Braatz, Richard D., Searson, Peter C., Alkire, Richard C.

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Prospects of on-chip fuelcell performance: improvement based on numerical simulation von Tominaka, Satoshi, Ohta, Sousuke, Osaka, Tetsuya, Alkire, Richard

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Initiation of corrosion pits at inclusions on 304 stainless steel von RUORU KE, ALKIRE, R

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Electrochemical engineering in an age of discovery and innovation von Alkire, Richard C., Braatz, Richard D.

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Coupled mesoscale-continuum simulations of copper electrodeposition in a trench von Drews, Timothy O., Webb, Eric G., Ma, David L., Alameda, Jay, Braatz, Richard D., Alkire, Richard C.

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Effect of Additives on Shape Evolution during Electrodeposition von Rusli, Effendi, Xue, Feng, Drews, Timothy O., Vereecken, Philippe M., Andricacos, Panos, Deligianni, Hariklia, Braatz, Richard D., Alkire, Richard C.

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Monte Carlo simulation of the electrodeposition of copper. I. Additive-free acidic sulfate solution von PRICER, Timothy J, KUSHNER, Mark J, ALKIRE, Richard C

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Monte Carlo simulation of the electrodeposition of copper. II. Acid sulfate solution with blocking additive von PRICER, Timothy J, KUSHNER, Mark J, ALKIRE, Richard C

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Evolution of surface roughness during copper electrodeposition in the presence of additives: Comparison of experiments and Monte Carlo simulations von DREWS, Timothy O, GANLEY, Jason C, ALKIRE, Richard C

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Multiscale systems engineering with applications to chemical reaction processes von Braatz, Richard D., Alkire, Richard C., Rusli, Effendi, Drews, Timothy O.

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Simulation of Kinetically Limited Nucleation and Growth at Monatomic Step Edges von Stephens, Ryan M., Alkire, Richard C.

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Additive-Assisted Nucleation and Growth by Electrodeposition von Stephens, Ryan M., Willis, Matthew, Alkire, Richard C.

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