A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices von Ahn, Heulbi, Bae, Jaeseok, Park, Jungjae, Jin, Jonghan

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Optical Fiber-Based Confocal and Interferometric System for Measuring the Depth and Diameter of Through Silicon Vias von Ahn, Heulbi, Park, Jungjae, Kim, Jong-Ahn, Jin, Jonghan

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Optical method for simultaneous thickness measurements of two layers with a significant thickness difference von Bae, Jaeseok, Park, Jungjae, Ahn, Heulbi, Jin, Jonghan

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Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb von Bae, Jaeseok, Park, Jungjae, Ahn, Heulbi, Jin, Jonghan

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A Review of Thickness Measurements of Thick Transparent Layers Using Optical Interferometry von Park, Jungjae, Kim, Jong-Ahn, Ahn, Heulbi, Bae, Jaeseok, Jin, Jonghan

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