Ultrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O3 and HF von Kim, Charles, Kim, Yongmok, Ahn, Dukmin, Hong, Seokjun, Kim, Tae Sung, Lee, Hunhee, Han, Hyeon Joon, Moon, Jinok

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Effect of DI-Water Dilution and Etchant Arm Movement on Spinning Type Wet Etch von Lim, Seung Taek, Lee, Hui Hwan, Kim, Tae Sung, Ahn, Dukmin

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Micro Unetched Oxide Defect during Buffered Oxide Etchant Process von Lim, SeungTaek, Ahn, Dukmin, Kim, Kihyun, Jung, Heechan, Lee, Byoungsu, Lee, Huihwan, Hwang, Hasub

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Micro Unetched Oxide Defect During Buffered Oxide Etchant Process von LIM, SeungTaek, Ahn, Dukmin, Kim, Kihyun, Jung, Heechan, Lee, Byoungsu, Lee, Huihwan, Hwang, Hasub

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8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology von KANG, Uksong, CHUNG, Hoe-Ju, LEE, Jae-Wook, JOO, Han-Sung, KIM, Woo-Seop, DONG HYEON JANG, NAM SEOG KIM, CHOI, Jung-Hwan, CHUNG, Tae-Gyeong, YOO, Jei-Hwan, JOO SUN CHOI, KIM, Changhyun, HEO, Seongmoo, JUN, Young-Hyun, PARK, Duk-Ha, LEE, Hoon, JIN HO KIM, AHN, Soon-Hong, CHA, Soo-Ho, AHN, Jaesung, KWON, Dukmin

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8Gb 3D DDR3 DRAM using through-silicon-via technology von Uksong Kang, Hoe-Ju Chung, Seongmoo Heo, Soon-Hong Ahn, Hoon Lee, Soo-Ho Cha, Jaesung Ahn, DukMin Kwon, Jin Ho Kim, Jae-Wook Lee, Han-Sung Joo, Woo-Seop Kim, Hyun-Kyung Kim, Eun-Mi Lee, So-Ra Kim, Keum-Hee Ma, Dong-Hyun Jang, Nam-Seog Kim, Man-Sik Choi, Sae-Jang Oh, Jung-Bae Lee, Tae-Kyung Jung, Jei-Hwan Yoo, Changhyun Kim

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