The effects of gas phase convection on mass transfer in spin coating von BORNSIDE, D. E, BROWN, R. A, ACKMANN, P. W, FRANK, J. R, TRYBA, A. A, GEYLING, F. T

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PELLICLE REPLACEMENT IN EUV MASK FLOW von Ackmann, Paul W, Sobieraj, Oktawian, Singh, SherJang

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DOUBLE PASS DILUTED ULTRAVIOLET RETICLE INSPECTION von Rankin, Jed H, Ackmann, Paul W, Lei, Ming, Ning, Guoxiang, Hsieh, Jung-Yu

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Pellicle replacement in euv mask flow von ACKMANN, PAUL W, SINGH, SHERJANG, SOBIERAJ, OKTAWIAN

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Hard mask etch and dielectric etch aware overlap for via and metal layers von Ning Guo Xiang, Ackmann Paul W, Lim Chin Teong, Shokeen Lalit, Hu Xiang, Ren Yuping, Power David

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Visualization of a gas flow instability in spin coating systems von WAHAL, S, OZTEKIN, A, BORNSIDE, D. E, BROWN, R. A, SEIDEL, P. K, ACKMANN, P. W, GEYLING, F. T

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METHOD WHEREIN TEST CELLS AND DUMMY CELLS ARE INCLUDED INTO A LAYOUT OF AN INTEGRATED CIRCUIT von UEBERREITER, GUIDO, NING, GUOXIANG, ACKMANN, PAUL W, LIM, CHIN TEONG, FENG, JUI-HSUAN

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Method wherein test cells and dummy cells are included into a layout of an integrated circuit von UEBERREITER, GUIDO, ACKMANN, PAUL W, LIM, CHIN TEONG, FENG, JUI-HSUAN, NING, GUO-XIANG

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Method and apparatus of etch modeling for semiconductor devices von HU, XIANG, REN, YUPING, ACKMANN, PAUL W, NING, GUO XIANG, POWER, DAVID, LIM, CHIN TEONG, SHOKEEN, LALIT

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Hard mask etch and dielectric etch aware overlap for via and metal layers von HU, XIANG, REN, YUPING, ACKMANN, PAUL W, NING, GUO XIANG, POWER, DAVID, LIM, CHIN TEONG, SHOKEEN, LALIT

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Hard Mask Etch And Dielectric Etch Aware Overlap For Via And Metal Layers von PAUL W. ACKMANN, YUPING REN, CHIN TEONG LIM, DAVID POWER, GUO XIANG NING, XIANG HU, LALIT SHOKEEN

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Recessed metallization von BRYANT, FRANK R, ACKMANN, PAUL W

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Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate von EDWARDS RICHARD D, BROWN STUART E, ACKMANN PAUL W, NGUYEN KHANH B

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