Modeling and Application of Multi-Port TSV Networks in 3-D IC von Wei Yao, Siming Pan, Achkir, B., Jun Fan, Lei He

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Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer von Chulsoon Hwang, Jingook Kim, Achkir, B., Jun Fan

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Fast admittance computation for TSV arrays von Dazhao Liu, Siming Pan, Achkir, B., Jun Fan

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Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer von Jingook Kim, Soumya De, Shringarpure, K., Siming Pan, Achkir, B., Jun Fan, Drewniak, J. L.

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Material parameter extraction using Time-Domain TRL (t-TRL) measurements von Rajagopal, A., Achkir, B., Koledintseva, M., Koul, A., Drewniak, J.

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Stressed jitter analysis for physical link characterization von Radhakrishnan, N, Achkir, B, Jun Fan, Drewniak, J L

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Parametric Testing of Optical Interfaces von Achkir, B., Zivny, P., Eklow, B.

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Employing embedded waveform viewing technology with EDC in 10Gb/s optical links von Balcioglu, A., Achkir, B.

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Power-bandwidth trade-off on TSV array in 3D IC and TSV-RDL junction design challenges von Wei Yao, Feng Shi, Lei He, Siming Pan, Achkir, B., Li Li

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Raman and microwave surface impedance measurements in the organic superconductor κ-Et2Cu[N(CN)2]BrxCl1-X von TRUONG, K. D, DANILOVIC, B, ACHKIR, D, JANDL, S, POIRIER, M

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Raman and microwave surface impedance measurements in the organic superconductor κ-Et 2Cu[N(CN) 2]Br xCl 1−x von Truong, K.P., Danilovic, B., Achkir, D., Jandl, S., Poirier, M.

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