Sonochemical and microwave synthesis and characterization of ZnO nanoparticles von Abhulimen, I.U., Das, K., Rangari, V.K., Bergman, L., Chen, X.-B., Morrison, J.L.

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Integrated System Development for 3-D VLSI von Schaper, L., Burkett, S., Gordon, M., Cai, L., Liu, Y., Jampana, G., Abhulimen, I.U.

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Effect of via profile on copper seed layer deposition for electroplating von Abhulimen, I.U., Lam, T., Kamto, A., Burkett, S., Schaper, L., Cai, L.

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Finite Element Analysis of Power Dissipation and Stress in 3-D Stack-Up Geometries von Boyt, D., Abhulimen, I.U., Gordon, M.H., Burkett, S., Schaper, L.

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Integrated system development for 3-D VLSI von Schaper, L., Yang Liu, Burkett, S.L., Kamto, A., Jampana, G., Jacob, S., Abhulimen, I.U.

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