Deep Subwavelength Anti-slot Photonic Crystals Fabricated in Monolithic Silicon Photonics Technology von Allen, J. A., Arnold, K. P., Halimi, S. I., Ryder, L. D., Afzal, F. O., Bian, Y., Aboketaf, A., Dezfulian, K., Rakowski, M., Augur, R., Hirokawa, T., Nummy, K., Weiss, S. M.

Volltext

Distress tolerance, coping motives, and alcohol craving and consumption: Two experiments testing momentary responses to a mood induction von Augur, Isabel F, Wolkowicz, Noah R, Ham, Lindsay S

Volltext

The influence of negative urgency and mood inductions on alcohol cognitions von Wolkowicz, Noah R., Augur, Isabel F., Ham, Lindsay S.

Volltext

Integration challenges of porous ultra low- k spin-on dielectrics von Mosig, K, Jacobs, T, Brennan, K, Rasco, M, Wolf, J, Augur, R

Volltext

Mechanism of reliability failure in Cu interconnects with ultralow-κ materials von Michael, N. L., Kim, Choong-Un, Gillespie, P., Augur, R.

Volltext

Innovative Law and Policy Responses to the Opioid Crisis von Hodge, James G., Gulinson, Chelsea L., Barraza, Leila, Augur, Haley R., Castagne, Michelle, Cheff, Ashley, Hensley, Drew, Sobek, Madeline, Weisberg, Adina

Volltext

MONSOON SEASONS WATER QUALITY STATUS OF GROUND WATER SYSTEM IN TAKHATPUR, BILASPUR DISTRICT, CHHATTISGARH, INDIA von Kumar Yadav, Rakesh, R. Augur, M.

Volltext

Study of electron-scattering mechanism in nanoscale Cu interconnects von KIM, Choong-Un, PARK, Jaeyong, MICHAEL, Nancy, GILLESPIE, Paul, AUGUR, R. O. D

Volltext

Mechanism of electromigration failure in submicron Cu interconnects von MICHAEL, Nancy L, KIM, Choong-Un, JIANG, Qing-Tang, AUGUR, R. A, GILLESPIE, P

Volltext

Declines in an Augur Buzzard Buteo augur Population in a Region of Increasing Human Development von Eichenwald, Adam J., Amar, Arjun, Tyrrell, Peter, Buechley, Evan R., Virani, Munir Z.

Volltext

Electromigration failure in ultra-fine copper interconnects von MICHAEL, Nancy L, KIM, Choong-Un, GILLESPIE, Paul, AUGUR, R. O. D

Volltext

Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals von JIANG, Qing-Tang, NOWELL, Matt, FORAN, Brendan, FRANK, Aaron, HAVEMANN, R. H, PARIHAR, Vijay, AUGUR, R. A, LUTTMER, J. D

Volltext

Subspecies and Distribution. R. c.c clivosus Cretzschmar, 1828 - SWJordan, W & C Saudi Arabia, Yemen, and SW Oman. R c. acrotis Heuglin, 1862 — Eritrea, Ethiopia, Djibouti, and N Somalia. R c. augur ÌL. Andersen, 1904 — N & C South Africa. R c. brachygnathus K. Andersen, 1905 - Israel, Egypt, and N Sudan. R c. geoffmyii A. Smith, 1829 — SW South Africa. R c. keniensis Hollister, 1916 - SE Sudan, South Sudan, Uganda, NE DR Congo, Rwanda, Burundi, Kenya, and N Tanzania; other records throughout C von Burgin, Connor

Volltext bestellen

Topographic Complexities and Solutions for High Density BEOL MIM Capacitors von Cheng, Lili, Kakita, Shinichiro, Fox, Robert, Motoyama, Emiko, Lee, Jusang, Azad, Nabil, Hart, Gregory, Ham, Sun, Sharma, Ankur, Beaudoin, Felix, Zhang, Galor Wenyi, de la Garza, Ernesto Gene, Babighian, Pietro, Wang, Tao, Yang, Xiaoming, Augur, Rod, Tang, Teck Jung

Volltext

Stress voiding and electromigration phenomena in aluminum alloys von Kordic, S., Augur, R.A., Dirks, A.G., Wolters, R.A.M.

Volltext

Efficient electromigration testing with a single current source von Kim, Choong-Un, Michael, N. L., Jiang, Qing-Tang, Augur, Rod

Volltext

Reliability and microstructure of Al-Si-V-Pd alloy films for use in ultralarge scale integration von Dirks, A. G., Augur, R. A.

Volltext

Electromigration study of Cu/low k dual-damascene interconnects von Lee, K.-D., Lu, X., Ogawa, E.T., Matsuhashi, H., Ho, P.S., Blaschke, V.A., Augur, R.

Volltext bestellen

AlSiV and AlSiVPd films as alternatives for AlSiCu interconnect: microstructure and its impact on reliability von Dirks, A.G., Augur, R.A., De Veirman, A.E.M.

Volltext

Augur—a computational pipeline for whole genome microbial surface protein prediction and classification von Billion, A., Ghai, R., Chakraborty, T., Hain, T.

Volltext