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    IC Substrate and Method of Manufacture of IC Substrate

    IC Substrate and Method of Manufacture of IC Substrate von ARMSTRONG BRIAN MERVYN, MCNEIL DAVID WILLIAM, MITCHELL NEIL SAMUEL JOHN, GAMBLE HAROLD SAMUEL

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    Miniaturisation and Integration of a Cantilever Based Photoacoustic Sensor into Micro Micromachined Device

    Miniaturisation and Integration of a Cantilever Based Photoacoustic Sensor into Micro Micromachined Device von Bain, Michael, Mitchell, Neil, Armstrong, B. Mervyn, Uotila, Juho, Kauppinen, Ismo, Terray, Eugene, Sonnichsen, Frederick, Ward, Brian


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