Defunctionalization of Ester-Substituted Electrochromic Dioxythiophene Polymers von Reeves, Benjamin D, Unur, Ece, Ananthakrishnan, Nisha, Reynolds, John R

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Tuning Polymer Light-Emitting Device Emission Colors in Ternary Blends Composed of Conjugated and Nonconjugated Polymers von Ananthakrishnan, Nisha, Padmanaban, G, Ramakrishnan, S, Reynolds, John R

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Photovoltaic Cells Based on Sequentially Adsorbed Multilayers of Conjugated Poly(p-phenylene ethynylene)s and a Water-Soluble Fullerene Derivative von Mwaura, Jeremiah K, Pinto, Mauricio R, Witker, David, Ananthakrishnan, Nisha, Schanze, Kirk S, Reynolds, John R

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Variable band gap conjugated polymers for optoelectronic and redox applications von Kim, Young-Gi, Thompson, Barry C., Ananthakrishnan, Nisha, Padmanaban, G., Ramakrishnan, S., Reynolds, John R.

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Morphology and Oxygen Sensor Response of Luminescent Ir-Labeled Poly(dimethylsiloxane)/Polystyrene Polymer Blend Films von Köse, Muhammet E, Crutchley, Robert J, DeRosa, Maria C, Ananthakrishnan, Nisha, Reynolds, John R, Schanze, Kirk S

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p-OXA-X: A new Oligo photosensitizer for organic solar cells von Kim, Young-Gi, Christian-Pandya, Hermona, Ananthakrishnan, Nisha, Niazimbetova, Zukhra I., Thompson, Barry C., Galvin, Mary E., Reynolds, John R.

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UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, LIN, Ziyin

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HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES von Nagarajan, Sivakumar, Shaw, Santosh, Gao, Wei, Akkinepally, Praneeth Kumar, Ananthakrishnan, Nisha

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Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap von Mehta, Vipul, Cetegen, Edvin, Zhong, Shan, Gujjula, Sushrutha, Wei, Yuying, Ananthakrishnan, Nisha, Lin, Ziyin

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PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS von Suthram, Sagar, Ananthakrishnan, Nisha, Aygun, Kemal, Mallik, Debendra, Sharma, Abhishek A, Gomes, Wilfred, Mahajan, Ravindranath Vithal, Ranade, Pushkar Sharad

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PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS von Suthram, Sagar, Ananthakrishnan, Nisha, Aygun, Kemal, Mallik, Debendra, Sharma, Abhishek A, Gomes, Wilfred, Mahajan, Ravindranath Vithal, Ranade, Pushkar Sharad

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PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS von ANANTHAKRISHNAN, Nisha, MALLIK, Debendra, RANADE, Pushkar Sharad, SHARMA, Abhishek Anil, SUTHRAM, Sagar, GOMES, Wilfred, MAHAJAN, Ravindranath Vithal, AYGUN, Kemal

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PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS von Suthram, Sagar, Ananthakrishnan, Nisha, Aygun, Kemal, Mallik, Debendra, Sharma, Abhishek A, Gomes, Wilfred, Mahajan, Ravindranath Vithal, Ranade, Pushkar Sharad

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MATERIALS COMPRISING LITHIUM ALUMINUM SILICATE FOR SEMICONDUCTOR MANUFACTURING TECHNIQUES, SEMICONDUCTOR PACKAGING TECHNIQUES, OR SEMICONDUCTOR PACKAGES von ANANTHAKRISHNAN, Nisha, MATAYABAS, James C, LIN, Ziyin

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Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control von Brun, Xavier F, Liang, Yawei, Patel, Jigneshkumar P, Wang, Liwei, Mistry, Kaizad, Ananthakrishnan, Nisha, Start, Paul R, Agraharam, Sairam

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MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik

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MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DISPENSE OF UNDERFILL BETWEEN A NARROW DIE-TO-DIE GAP von ANANTHAKRISHNAN, Nisha, CETEGEN, Edvin, WEI, Yuying, MEHTA, Vipul, LIN, Ziyin, ZHONG, Shan, GUJJULA, Sushrutha

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MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik

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MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE von ANANTHAKRISHNAN, Nisha, NOFEN, Elizabeth, EITAN, Amram, ROSS, Nick, DECKER, John C, LI, Hsin-Yu, NICKERSON, Robert M, GUO, Yang, GOKHALE, Shripad, MUTHUR SRINATH, Purushotham Kaushik

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Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap von Mehta, Vipul, Cetegen, Edvin, Zhong, Shan, Gujjula, Sushrutha, Wei, Yuying, Ananthakrishnan, Nisha, Lin, Ziyin

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