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  1. 1
    Apparatus and method for direct silicon chip attachment to a lead frame

    Apparatus and method for direct silicon chip attachment to a lead frame von YEW CHEE KIANG, AMAGI MASAZUMI

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  2. 2
    Investigation of stress singularity fields and stress intensity factors for interfacial delamination (an application of thermosetting polyimide for a tapeless lead-on-chip (LOC) package)

    Investigation of stress singularity fields and stress intensity factors for interfacial delamination (an application of thermosetting polyimide for a tapeless lead-on-chip (LOC) pa... von Amagi, M.


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