Expectation of Composites for Electrical Machineries von AMAGI, Shigeo

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Numerical Analysis of Residual Stress in Resin-Molded Products:2nd Report, Orthotropic Visco-Elastic Analysis of Residual Stress in FRP Structures von SASAKI, Koji, SAITO, Naoto, AMAGI, Shigeo, TSUNODA, Tomoya

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プラスチックを用いた環境適合製品 von 天城, 滋夫

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Numerical Analysis of Residual Stress in Resin-Molded Products : 1st Report, Visco-Elastic Analysis of Stress and Deformation caused by Cooling after the Curing Process von SASAKI, Koji, SAITO, Naoto, AMAGI, Shigeo, HARAGUCHI, Yoshihiro

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重電機用複合材料への期待 von 天城, 滋夫

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環境を配慮した家電製品 von 天城, 滋夫

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MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC EQUIPMENT von AMAGI SHIGEO, MURAKAWA SATOSHI

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Influence of Lamination on Static Strengths of C/A Hybrid Unidirectional Reinforced FRP Laminates von AMAGI, Shigeo, MIYANO, Yasushi

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SEMICONDUCTOR DEVICE, POWER SEMICONDUCTOR MODULE, AND POWER CONVERSION DEVICE EQUIPPED WITH POWER SEMICONDUCTOR MODULE von ISHIKAWA, HIDEAKI, SATOH, TOSHIYA, TSUYUNO, NOBUTAKE, TOKUYAMA, TAKESHI, SAITO, RYUICHI, AMAGI, SHIGEO, NAKATSU, KINYA

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プラスチックを用いた環境適合製品 von Amagi, Shigeo

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The Method for Evaluation of Fracture Toughness on Resin von AMAGI, Shigeo

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Development of Terrain-Adaptable Mobile Mechanism for Actual Indoor Passage von IWAMOTO, Taro, YAMAMOTO, Hiroshi, AMAGI, Shigeo

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COMPOSITE MOLDING AND MOLDING PROCESS von MIYO, OSAMU, AMAGI, SHIGEO, OHASHI, KATSUHIDE, AOKI, SADAYUKI

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MOLDED MEMBER HAVING INSERT MEMBER AND METHOD FOR MANUFACTURE THEREOF von SOSHINO, MASAHIKO, MIYO, OSAMU, AMAGI, SHIGEO, OHASHI, KATSUHIDE, SUDO, MITSURU

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Influence of Laminate Constitution on Impact Behavior of C/A Hybrid Unidirectional FRP Laminates von AMAGI, Shigeo, NAKADA, Masayuki, SHIMBO, Minoru, MIYANO, Yasushi

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Substrate for Display Device and Display Device Using the Same von HANAWA YASUO, AMAGI SHIGEO, OOAKU HITOSHI, OOISHI TOMOJI, KONDOH KATSUMI

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環境を配慮した家電製品 von Amagi, Shigeo

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INSULATING MATERIAL, ELECTRIC WINDING, AND METHOD OF MANUFACTURE THEREOF von ONODA, MITSURU, AMAGI, SHIGEO, TSUNODA, TOMOYA, HONDA, TATSUO

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The effect of time and temperature on flexural creep and fatigue strength of a silica particle filled epoxy resin von MCMURRAY, M. K, AMAGI, S

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POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE INCLUDING THE POWER SEMICONDUCTOR MODULE von AMAGI, Shigeo, ISHIKAWA, Hideaki, SATOH, Toshiya, TSUYUNO, Nobutake, TOKUYAMA, Takeshi, SAITO, Ryuichi, NAKATSU, Kinya

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