In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures von Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila, Tu, K. N., Gusak, A. M., Meyer, Moritz Andreas, Zschech, Ehrenfried

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Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences von Vairagar, A.V, Mhaisalkar, S.G, Krishnamoorthy, Ahila

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Investigation of electrical conduction in carbon-doped silicon oxide using a voltage ramp method von Yiang, K. Y., Yoo, W. J., Guo, Q., Krishnamoorthy, Ahila

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Study of leakage mechanisms of the copper/Black Diamond™ damascene process von Yiang, K.Y., Guo, Q., Yoo, W.J., Krishnamoorthy, Ahila

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Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation von Zschech, Ehrenfried, Engelmann, Hans-Jürgen, Meyer, Moritz Andreas, Kahlert, Volker, Vairagar, Anand V., Mhaisalkar, Subodh G., Krishnamoorthy, Ahila, Yan, Minyu, Tu, K. N., Sukharev, Valeriy

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Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects von Ngwan, V.C., Zhu, Chunxiang, Krishnamoorthy, Ahila

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A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects von Yan, M.Y., Tu, K.N., Vairagar, A.V., Mhaisalkar, S.G., Krishnamoorthy, Ahila

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12.2: Solution Processable Passivation Layer for Active Matrix Thin Film Transistors on Rigid and Flexible Substrates von Krishnamoorthy, Ahila, Spear, Richard, Gebrebrhan, Amanuel, Stifanos, Mehari, Bien, Hai, Lowe, Marie, Yellowaga, Deborah, Smith, Peter, O'Rourke, Shawn, Loy, Doug, Dailey, Jeff, Marrs, Michael, Ageno, Scott

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Effect of etching process deviations and photoresist stripping on contact yield of copper dual damascene metallization von KRISHNAMOORTHY, Ahila, BLIZNETSOV, Vladimir, HUI LENG TAY, BO YU

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Performance properties in thick film silicate dielectric layers using molecular modeling von Iwamoto, Nancy, Krishnamoorthy, Ahila, Spear, Richard

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65.2: Spin-On Polymers for TFT Gate Dielectric Application and Planarization of Stainless Steel von Chen, Jinghong, Stifanos, Mehari, Fan, Wenya, Nedbal, Jan, Rose, Jeff, Krishnamoorthy, Ahila, Brouk, Emma, Smith, Pete, Daniels, Brian

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IMPROVED ABSORBENT GLASS MAT SEPARATORS, VRLA BATTERIES, AND RELATED METHODS OF MANUFACTURE AND USE von ALEXANDER, Daniel, R, KRISHNAMOORTHY, Ahila

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Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects von Vairagar, A.V., Mhaisalkar, S.G., Krishnamoorthy, Ahila

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Dependence of leakage mechanisms on dielectric barrier in Cu–SiOC damascene interconnects von Ngwan, V. C., Zhu, Chunxiang, Krishnamoorthy, Ahila

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COMPOSITE LAYERS OR SEPARATORS FOR LEAD ACID BATTERIES von Saffel, Robert, Krishnamoorthy, Ahila, Manickam, Kumar

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IMPROVED ABSORBENT GLASS MAT SEPARATORS, VRLA BATTERIES, AND RELATED METHODS OF MANUFACTURE AND USE von ALEXANDER, Daniel, R, KRISHNAMOORTHY, Ahila

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Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects von Yan, M. Y., Suh, J. O., Ren, F., Tu, K. N., Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila

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Composite layers or separators for lead acid batteries von Saffel, Robert, Krishnamoorthy, Ahila, Manickam, Kumar

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Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures von Vairagar, A. V., Mhaisalkar, S. G., Meyer, M. A., Zschech, E., Krishnamoorthy, Ahila, Tu, K. N., Gusak, A. M.

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IMPROVED ABSORBENT GLASS MAT SEPARATORS, VRLA BATTERIES, AND RELATED METHODS OF MANUFACTURE AND USE von ALEXANDER, Daniel, R, KRISHNAMOORTHY, Ahila

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