An overview of through-silicon-via technology and manufacturing challenges von Gambino, Jeffrey P., Adderly, Shawn A., Knickerbocker, John U.

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Electric and gasoline vehicle total cost of ownership across US cities von Woody, Maxwell, Adderly, Shawn A., Bohra, Rushabh, Keoleian, Gregory A.

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Electric vehicles and natural disaster policy implications von Adderly, Shawn A., Manukian, Daria, Sullivan, Timothy D., Son, Mun

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A process to reduce the occurrence of metal extrusions in al interconnects von Adderly, Shawn A., Gambino, Jeffrey P., Sullivan, Timothy D., Moon, Matthew D., Speranza, Anthony C., Bowe, Nathaniel W., Thomas, David C.

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Nano deposition and ablation for the repair and fabrication of integrated circuits von Adderly, Shawn A, Gambino, Jeffrey P, Speranza, Anthony C, Joseph, Eric A

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Waveguide structures used in phonotics chip packaging von Adderly, Shawn A, Letourneau, Donald R, DiStefano, Samantha D, Gambino, Jeffrey P, Periasamy, Prakash

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WAVEGUIDE STRUCTURES von Letourneau Donald R, Adderly Shawn A, Gambino Jeffrey P, DiStefano Samantha D, Periasamy Prakash

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NANO DEPOSITION AND ABLATION FOR THE REPAIR AND FABRICATION OF INTEGRATED CIRCUITS von Joseph Eric A, Adderly Shawn A, Speranza Anthony C, Gambino Jeffrey P

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Centering substrates on a chuck von Adderly, Shawn A, Moon, Matthew D, DiStefano, Samantha D, Lifson, Max L, Gambino, Jeffrey P, Sullivan, Timothy D, Levy, Max G

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Nano deposition and ablation for the repair and fabrication of integrated circuits von Joseph Eric A, Adderly Shawn A, Speranza Anthony C, Gambino Jeffrey P

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The effect of etch residuals on via reliability von Adderly, Shawn A., Moon, Matthew D., Lifson, Max L., Bowe, Nathaniel W., Gambino, Jeffrey P., Sullivan, Timothy D.

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Void monitoring device for measurement of wafer temperature variations von Esposito Mark J, Adderly Shawn A, Gambino Jeffrey P, DiStefano Samantha D, Periasamy Prakash

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CENTERING SUBSTRATES ON A CHUCK von Adderly, Shawn A, Moon, Matthew D, DiStefano, Samantha D, Lifson, Max L, Gambino, Jeffrey P, Sullivan, Timothy D, Levy, Max G

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VOID MONITORING DEVICE FOR MEASUREMENT OF WAFER TEMPERATURE VARIATIONS von ESPOSITO MARK J, ADDERLY SHAWN A, PERIASAMY PRAKASH, DISTEFANO SAMANTHA D, GAMBINO JEFFREY P

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Centering substrates on a chuck von Adderly, Shawn A, Moon, Matthew D, DiStefano, Samantha D, Lifson, Max L, Gambino, Jeffrey P, Sullivan, Timothy D, Levy, Max G

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Anticipatorily loading a page of memory von NIEKREWICZ PAUL A, SUREN AYDIN, ADDERLY SHAWN A, VENTRONE SEBASTIAN T

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Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer von ADDERLY SHAWN A, MURPHY WILLIAM J, GAMBINO JEFFREY P, CHAPPLE-SOKOL JONATHAN D

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NANO DEPOSITION AND ABLATION FOR THE REPAIR AND FABRICATION OF INTEGRATED CIRCUITS von ADDERLY SHAWN A, SPERANZA ANTHONY C, JOSEPH ERIC A, GAMBINO JEFFREY P

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CENTERING SUBSTRATES ON A CHUCK von Moon Matthew D, Adderly Shawn A, Lifson Max L, Gambino Jeffrey P, DiStefano Samantha D, Levy Max G, Sullivan Timothy D

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Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness von Babinski Kyle, Moon Matthew D, Goddard Shawn R, DeMuynck David A, Schneider Craig E, Adderly Shawn A, Roma Melissa J, Delibac Daniel A

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