Electrochemical machining with ultrashort voltage pulses: modelling of charging dynamics and feature profile evolution von Kenney, Jason A, Hwang, Gyeong S

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Capacitively Coupled Plasma With an Asymmetric Dielectric Plate von Kenney, J. A., Rauf, S., Collins, K.

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Fully Self-Consistent 3-D Modeling of Inductively Coupled Plasmas von Agarwal, Ankur, Kenney, Jason A., Rauf, Shahid, Collins, Ken

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Effect of azimuthally asymmetric reactor components on a parallel plate capacitively coupled plasma von Kenney, Jason A., Rauf, Shahid, Collins, Ken

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Prediction of stochastic behavior in differential charging of nanopatterned dielectric surfaces during plasma processing von Kenney, Jason A., Hwang, Gyeong S.

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Two-dimensional computational model for electrochemical micromachining with ultrashort voltage pulses von Kenney, Jason A., Hwang, Gyeong S., Shin, Woonsup

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Capacitively Coupled Plasma With Widely Spaced Confinement Grid: Images in Plasma Science von KENNEY, Jason A, RAUF, Shahid, COLLINS, Ken

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A COMPOSITE EDGE RING von Ａ KENNEY, JASON A, SRINIVASAN, SUNIL, DHINDSA, RAJINDER, JOUBERT, OLIVIER, Ｓ ACHUTHARAMAN, VEDAPURAM S, ROGERS, JAMES, LUERE, OLIVIER

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Stochastic Plasma Charging of Nanopatterned Dielectric Surfaces: Images in Plasma Science von KENNEY, Jason A, PAEK, Eunsu, HWANG, Gyeong S

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Capacitively Coupled Plasma With Widely Spaced Confinement Grid von Kenney, J.A., Rauf, S., Collins, K.

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Stochastic Plasma Charging of Nanopatterned Dielectric Surfaces von Kenney, J.A., Eunsu Paek, Hwang, G.S.

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Computational Analysis of Intratool Interactions in Electrochemical Micromachining with Multitip Tool Electrodes von Kenney, Jason A., Hwang, Gyeong S.

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Apparatus to reduce polymers deposition von Chang, Xue, Kenney, Jason A, Nguyen, Andrew, Rauf, Shahid

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APPARATUS TO REDUCE POLYMERS DEPOSITION von KENNEY, Jason A, CHANG, Xue, NGUYEN, Andrew, RAUF, Shahid

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REDUCING ASPECT RATIO DEPENDENT ETCH WITH DIRECT CURRENT BIAS PULSING von DASH, Shreeram Jyoti, KENNEY, Jason A, LI, Deyang, EPPLER, Aaron, LIU, Chung, JOUBERT, Olivier P, SRINIVASAN, Sunil, LIU, Kuan-Ting, NICHOLS, Michael Thomas, CHOU, Yi-Chuan, RAUF, Shahid

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Universal process kit von Rogers, James, Joubert, Olivier, Kenney, Jason A, Achutharaman, Vedapuram S, Luere, Olivier, Srinivasan, Sunil, Dhindsa, Rajinder

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Symmetrical plural-coil plasma source with side RF feeds and RF distribution plates von Fovell, Richard, Collins, Kenneth S, Kenney, Jason A, Ramaswamy, Kartik, Carducci, James D, Rauf, Shahid

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Symmetrical inductively coupled plasma source with coaxial RF feed and coaxial shielding von Fovell, Richard, Kenney, Jason A, Collins, Kenneth S, Ramaswamy, Kartik, Carducci, James D, Rauf, Shahid

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Multiple coil inductively coupled plasma source with offset frequencies and double-walled shielding von Fovell, Richard, Kenney, Jason A, Collins, Kenneth S, Ramaswamy, Kartik, Carducci, James D, Rauf, Shahid

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METHOD TO MODULATE THE WAFER EDGE SHEATH IN A PLASMA PROCESSING CHAMBER von KENNEY, Jason A, LEE, Wonseok, HUSAIN, Anwar, RAMASWAMY, Kartik, LUDWIG, Jeffrey, ZHANG, Chunlei, WANG, Haitao

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