Effects of pattern characteristics on the copper electroplating processt von 阮文彪 陈岚 李志刚 叶甜春 马天宇 王强

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An electroplating topography model based on layout-dependent variation of copper deposition rate von 王强 陈岚 李志刚 阮文彪

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Effects of pattern characteristics on the copper electroplating process von Ruan, Wenbiao (文彪 阮), Chen, Lan (岚陈), Li, Zhigang (志刚 李), Ye, Tianchun (甜春 叶), Ma, Tianyu (天宇 马), Wang, Qiang (强王)

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