Recent Advances in Microelectronics Reliability: Contributions from the European ECSEL JU project iRel40 von Driel, Willem Dirk van, Pressel, Klaus, Soyturk, Mujdat

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Microelectronics Reliability: Publisher’s note von Li, Jimeng

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CHARM High-Energy Ions for Microelectronics Reliability Assurance (CHIMERA) von Bilko, Kacper, Alia, Ruben Garcia, Costantino, Alessandra, Coronetti, Andrea, Danzeca, Salvatore, Delrieux, Marc, Emriskova, Natalia, Fraser, Matthew Alexander, Girard, Sylvain, Johnson, Eliott Philippe, Sebban, Marc, Ravotti, Federico, Waets, Andreas

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Microelectronics Reliability: Publisher's Note

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Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann–Arrhenius–Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models von Suhir, E.

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Editorial, Microelectronics Reliability, Volume 55, Issues 9–10, August–September 2015 von Bafleur, Marise, Perdu, Philippe, Marc, François, Frémont, Hélène, Nolhier, Nicolas

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Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability von Fan, Xuejun, Chen, Liangbiao, Wong, C.P., Chu, Hsing-Wei, Zhang, G.Q.

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Quantifying Microelectronics Reliability Under Cumulative Radiation Damage: Stress-Strength Inference with Type-I Censored Data for Failure Probability Estimation von Champagne, Chloe Alexandra

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Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound von Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, G. Q.

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Correlation between chemistry of polymer building blocks and microelectronics reliability von Bressers, H.J.L., van Driel, W.D., Jansen, K.M.B., Ernst, L.J., Zhang, G.Q.

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Microelectronics Reliability von Mayberry,Clay, Bernstein,Joseph

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From "Star Trek" to "Avatar"Microelectronics reliability in the 21st century [Keynote Address] von McCants, Carl

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Reliability prediction with MTOL von Bernstein, Joseph B., Bensoussan, Alain, Bender, Emmanuel

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High temperature reliability of lead-free solder joints in a flip chip assembly von Amalu, Emeka H., Ekere, Ndy N.

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Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound von Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, Guoqi

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Reliability investigation of gallium nitride HEMT microelectronics reliability von Sozza, A., Dua, C., Morvan, E., Grimbert, B., Hoel, Virginie, Delage, S.L., Chaturvedi, N., Lossy, R., Wuerfl, J.

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Tutorial: temperature as an input to microelectronics-reliability models von Lall, P.

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The Role of Singly-Charged Particles in Microelectronics Reliability von Sierawski, Brian David

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Unsupervised image processing scheme for transistor photon emission analysis in order to identify defect location von Chef, Samuel, Jacquir, Sabir, Sanchez, Kevin, Perdu, Philippe, Binczak, Stéphane

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In-situ X-ray μLaue diffraction study of copper through-silicon vias von Sanchez, Dario Ferreira, Reboh, Shay, Weleguela, Monica Larissa Djomeni, Micha, Jean-Sébastien, Robach, Odile, Mourier, Thierry, Gergaud, Patrice, Bleuet, Pierre

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