Cooling High Power Dissipating Artificial Intelligence (AI) Chips Using Refrigerant von Mukatash, Waheeb, Kabbani, Hussameddine, Massalt, Jochem Marc, Moscoso, Matthew, Robles, Merari Mejia, Yang, Tyler, Nino, Charlie

Volltext

Investigation of Liquid Cooling Plate for Server CPUs Based on Topology Optimization von Ai, Guijun, Luo, Yingying, Su, Wei

Volltext

A Theoretical Study on Energy of a Gaseous System Vis-a-Vis Mass and Temperature von Karn, Santosh K., Demiroglu, Necati

Volltext

Numerical Study of Thin Film Condensation in Forced Convection of Saturated Vapor on a Vertical Wall Covered with a Porous Material von Ndiaye, Momath, Ndiaye, Goumbo, Sene, Madialène

Volltext

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis von Touré, Mamadou Kabirou, Souaré, Papa Momar, Sylvestre, Julien

Volltext

New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids von Griesinger, Andreas, Windel, Christian, Kwak, Yungwan, Petuchow, Arthur

Volltext

Techno-Economic and Sustainability Analysis of Potential Cooling Methods in Irish Data Centres von Gibbons, Lee, Persoons, Tim, Alimohammadi, Sajad

Volltext

Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel von Abbasinejad, Hasan, Hoseini Abardeh, Reza

Volltext

Optimal Thermal Insulation Thickness in Isolated Air-Conditioned Buildings and Economic Analysis von Mohamed, Mousa M.

Volltext

Proposal of Functional Thermal Control Systems for High-Power Micro-Satellite and Its Demonstration under Thermal Vacuum Condition von Ueno, Ai, Yamada, Kohei, Miyata, Kikuko, Nagano, Hosei

Volltext

Investigation and Comparison of the DIBL Parameter and Thermal Effects of SOD Transistors and SOI Transistors and Improving Them with the Change of Their BOX Thicknesses von Laderian, Nooshien, Daghighi, Arash

Volltext

Formula of Thermogradient Effect von Kovziridze, Zviad

Volltext

Failure Stress Energy Formula von Kovziridze, Zviad

Volltext

Simulation of District Cooling Plant and Efficient Energy Air Cooled Condensers (Part I) von Mohamed, Mousa M., Almarshadi, Mohammed Hueesin

Volltext

Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules von Sturdivant, Rick, Bogdon, Astacian, Chong, Edwin K. P.

Volltext

Fabrication and Characterization of PLD-Grown Bismuth Telluride (Bi 2 Te 3 ) and Antimony Telluride (Sb 2 Te 3 ) Thermoelectric Devices von Abdel-Motaleb, Ibrahim M., Qadri, Syed M.

Volltext

A Spectrally Selective Window for Hot Climates von Sid-Ahmed, M. O., Bilal, M. H., Babiker, S. G.

Volltext

Compact Thermal Management Device Using Electrocaloric Effect von Xi, Yuchen

Volltext

Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias von Koito, Yasushi, Tomimura, Toshio

Volltext

Radiator Vibration Fatigue Analysis von Ismael, Toure, Sheng, Buyun

Volltext