Announcing the IEEE Transactions on Signal and Power Integrity von Fan, Jun, Drewniak, James L.

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IEEE Transactions on Signal and Power Integrity Information for Authors

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IEEE Transactions on Signal and Power Integrity Information for Authors

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2023 Index IEEE Transactions on Signal and Power Integrity Vol. 2

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2022 Index IEEE Transactions on Signal and Power Integrity Vol. 1

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Signal Integrity and Power Integrity von Tripathi, Jai Narayan

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Letter from the Editor

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Augmented Genetic Algorithm for Decoupling Capacitor Optimization in Power Distribution Network Design Through Improved Population Generation von Juang, Jack, Zhang, Ling, Manoharan, Haran, De Paulis, Francesco, Hwang, Chulsoon

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Perturbed Pin Map Design for Low Differential Crosstalk in 112 Gb/s PAM4 Applications von Zhang, Mu-Shui, Ding, Yingfeng, Wang, Zixin

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Optimized Signal and Power Integrity of Silicon Interposer for HBM2E in CoWoS Packaging von Lin, Kuei-Ju, Lin, Chien-Min, Wu, Ruey-Beei

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Ultrawideband Power-Noise Suppression Based on Lossy Capacitors With Low-Frequency Stopband Enhancement for Digital Systems von Ding, Yingfeng, Zhang, Mu-Shui, Xu, Yufang, Feng, Haopeng, Wang, Zixin

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Dual-Stripline Configuration for High-Density Routing in Chiplet Interconnects von Geedimatla, Shekar, Balachandran, Jayaprakash, Vysakham, Midhun, Venkataraman, Srinivas, Gupta, Shalabh

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Bandpass NGD Analysis of PCB Folded Li-Shape Trace von Wan, Fayu, Jia, Hongchuan, Ravelo, Blaise

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Investigation of Voltage Regulator Module (VRM)-Induced Noise to High-Speed Signals With VRM via Design Factors von Joo, Junho, Mathew, Manish K., Chada, Arun, Singh, Soumya, PK, Seema, Mutnury, Bhyrav, Kim, DongHyun

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A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model von Park, Junyong, Li, Chaofeng, Mok, Eddie, Dickson, Joe, Tourne, Joan, Thurairajaratnam, Aritharan, Kim, DongHyun

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Variability-Aware Modeling of Power Supply Induced Jitter von Verma, Vinod Kumar, Tripathi, Jai Narayan

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Front Cover

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Analytical Modeling of Deterministic Jitter in CMOS Inverters von Verma, Vinod Kumar, Tripathi, Jai Narayan

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Inductance Calculation for the Power Net Area Fill of Packages and PCBs Based on Plane-Pair PEEC von Bai, Siqi, Connor, Samuel, Becker, Wiren Dale, Archambeault, Bruce, Ruehli, Albert E.

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Fast PCB Stack-Up Optimization Using Integer Programming von He, Jiayi, Zhang, Ling, Kiguradze, Zurab, Chada, Arun, Klivans, Adam, Mutnury, Bhyrav, Li, Er-Ping, Fan, Jun

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